iSpector desktop automated optical inspection offers one top camera and eight side cameras in 45/45° configuration. Solder joints of 45° circuitry designs can be inspected with 10µm resolution side cameras. Combines simultaneous nine camera inspection, 24-bit color imaging technology, and 3D solder meniscus profiling. 

Mek Europe BV, www.mek-europe.com

5K Spectro, for printed circuit boards automated optical inspection, uses a 12-bit color camera, reportedly delivering 16x the information provided by an 8-bit camera. An advanced GPU provides pre-processed images to the Core i7 PC. Incorporates a high-intensity programmable broadband lighting system.

Vi Technology, www.vitechnology.com

2K Perform is a compact AOI designed to handle small- to medium-sized printed circuit boards. Offers 14" x 14" board capability at the same performance levels as the 3K, 5K and 7K series. Uses P series acquisition head, including i-Lite illumination system. Applications include 2D SPI, mixed mode inspection, closed loop enabled by pre-reflow inspection, post-reflow inspection, off-line programming, versatile repair strategies, embedded and external SPC tools, and VieWeb data reporting solutions.  

Vi Technology, www.vitechnology.com

Vision 20 AOI/SPI software suite provides defect detection from 2D SPI through pre- and post-reflow and post-wave applications. Is for low-volume/high-mix production. Features offline programming capability, including program tuning. Resolution reportedly handles 01005 components.

Vi Technology, www.vitechnology.com

SMD Tower 513 XL is an automated and expandable buffer storage unit designed for near-production deployment. Ensures correct component remains stored in the correct place and in a controlled atmosphere. Is optimized for high-volume manufacturing and provides 70% more space for large reels in the same 1 m2 footprint as Tower 200. Can store up to 336 13" reels and 600 trays. Is MSD-compliant.

Mydata, www.mydata.com

PVA6000 coating and dispensing system combines an extruded aluminum frame with sheet metal finishing. Includes a hatch similar to PVA650. Pneumatics, ventilation and facilities are fully enclosed in a cabinet at the rear of the machine. Onboard PC features Portal software; permits unlimited program storage capability, fluid level monitoring, integration of vision systems, barcode readers, flow monitors, and other options. Has updated motion platform.

PVA, www.pva.net

Genesis GX-37D is a multipurpose surface-mount platform, placing chips at high-speed. Combines Series 2 Lightning placement head with InLine7 head for a component range of 01005 passives to 150mm sq. Handles odd-form components up to 25mm tall with 2.5kg grams of placement force. Features nozzle-changer support for gripper nozzles. Provides standalone prototyping solution, or a line balancer capable of taking on component placements from up-line or down-line machines.

Universal Instruments Corp., www.uic.com

Agilis Flex feeder is for larger components. Now covers any component on tape or stick, and reportedly cuts loading and unloading times to a fraction of that of conventional feeders. Is capable of handling component tapes from 8mm up to 152mm in width. Pocket depths accommodate the thickest, tallest components.

Mydata, www.mydata.com

A new function for PowerSelective compensates product or production-related warpage of assemblies to be processed. During program generation for the mini-wave soldering process, the operator specifies all board areas that are mechanically supported and gives a correct z-level. A reference point is defined. The operator specifies an arbitrary number of points on the soldering side of the assembly. A high-precision laser measuring system determines the distance of the PCB from the previously defined points prior to soldering. These values and the z height of the reference point are the basis for a precise calculation for modeling and illustrating an altitude profile. All points of the soldering program are set off against the modeled value. PCB warpage compensation, with the automatic PCB alignment based on fiducial recognition, guarantees reproducible xyz positioning.

SEHO Systems, www.seho.de

TR518 SII manufacturing defect analyzer includes up to 2,560 analog test points and TestJet technology. Has a 100V high voltage current source. Is backward compatible with TR518. Has Windows 7 system interface design and USB interface.

Test Research Inc., www.tri.com.tw

AV862 AOI system is capable of detecting faults such as absence/presence, OCR, polarity, solder bridging, registration and more.   

ASC International, www.solderpasteinspection.com or www.ascinternational.com 

Multicore HF200 is a Pb-free, zero- halogen solder paste for multiple processes, including handheld applications. Is said to be reliable, easy to process, and offers low voiding.

Henkel, www.henkel.com/electronics