Multicore MF390HR halogen-free, no-clean flux is said to offer high activity for wave soldering. Reportedly has good through-hole penetration, minimal residues and sustained performance for a broad process window. Compatible with automotive processes and consumer electronics handheld applications. 

Henkel, www.henkel.com/electronics

Ablestik ICP-3535M1 is a single component ECA for use with tin-terminated components. Reportedly has excellent electrical and adhesion stability, no bleeding or wicking on miniaturized components, and cures quickly at low temperature.

Henkel, www.henkel.com/electronics

Ablestik ICP-4000 is a high-end conductive silicone adhesive technology for automotive applications. Has been qualified for automotive sensor products where components are bonded to metal leadframes inside plastic housings. Absorbs CTE stresses, maintains bond and delivers electrical interconnect between component and leadframe.

Henkel, www.henkel.com/electronics

TR7550 SII inline AOI offers a dual-lane configuration and has a 64-bit operating environment; permits multi-core processing technology. Has expanded memory capacity. Image FOV has doubled in size, reducing the number of scans required and reportedly cutting inspection times in half. Linear motor and linear scale create a stable X-Y table motion system. Includes digital 3 CCD full-color camera at the top and four angle cameras; RGB 3-color LED color lighting system and multi-angle lighting control system. Inspection is suitable for Pb-free manufacturing and fine-pitch/01005 components. Repair station system has graphical interface. Provides SPC calculations and reports.

TRI, www.tri.com.tw

ESLE-10 one-part silver-loaded epoxy resin for conductive bonding offers mechanical bonds and electrical conductivity. Reportedly has excellent adhesion; can be used as a conductive bond between solder-free surface mount connections, solder repairs, static discharge and grounding or general conductive adhesions. Operating temperature is -30 to +130°C. Has an electrical resistivity value of <0.0005 ohm-cm.

ES501 underfill resin is said to improve adhesion strength of devices during mechanical stress. Reportedly does not compromise thermal cycle performance. Can be reworked, and used in high-volume assembly. Provides void-free underfill of area array devices; has snap-curable properties. Typical curing times of 35-40 min. at 90°C or 3 min. at 150°C.

Electrolube, www.electrolube.com

Component counters are said to handle all part sizes, including 01005s. Detect missing parts while deducting them from the total. Include handheld and motorized versions. Handles surface-mount and through-hole (axial and radial leaded) components. Another model includes a barcode reader and scanner, plus a label printer that outputs quantity, lot number, company name and barcode. Software counts SMDs directly on the pick-and-place machine.

Manncorp, www.manncorp.com

Mascot hand assembly workstation is for attaching through-hole and odd form insertion, inspection and printed circuit board rework. Is said to eliminate setup time; good for high mix, small- to medium-sized batch runs. Can reportedly reduce mistakes by 60%. Does not require training. Program changes can be made quickly.

Robotas Technologies, http://www.robotas.com/standalone.html

TCQ automatic tray changer reportedly can replace a component tray in fewer than 5 sec. and align it with accuracy better than 50µm. The 18-bin changer comes on Cobra and Paraquda pick-and-place machines. Trays are stored in a magazine equipped with handles; can be replaced quickly. Standard magazines feature 18 or 14 slots, depending on tray thickness. Each slot has room for one standard Jedec tray; the space can be divided for several smaller trays.

Essemtec, www.essemtec.com  

ES 808 surface mount adhesive is for bonding of surface-mounted devices to printed circuit boards prior to wave soldering. Is for medium to high dispense speeds and high dot profiles; is suitable for pin transfer and stencil print. Is said to have good humidity resistance, high wet strength and good electrical characteristics, excellent mechanical strength and long-term stability. ES 807 is for high-speed dispensing (25,000 - 50,000 dph). Reportedly has outstanding dot profile, excellent adhesion substrate and wetting strength. Typical cure temperature of 130°C and 90 sec. cure time or 60 sec. at 150°C.

Electrolube, www.electrolube.com

Valor MSS Business Intelligence product suite allows management of printed circuit board assembly lines to obtain reports and analysis of the quality, asset utilization, and materials management of production execution. Covers manufacturing execution process from line planning through execution, traceability, materials management, and test/quality assurance. Data are generated and made available to the business intelligence application for analysis and display functionality on management’s desktop. Dashboard display technology is reportedly easy to configure and use. Business intelligence functionality comes with more than 30 standard reports, as well as the ability to customize to the specific configurations and needs of the manufacturing organization.

Mentor Graphics, http://mentor.com/go/valor/bi

Poly-Max urethane squeegee holders are tailored for advanced screen-printing applications including solar cell conductor printing, conductive epoxy printing, printed circuit board nomenclature printing, solder mask printing, and conductive resist printing. Available for over 50 printing platforms, including DEK, MPM, Panasonic, Ekra, Yamaha, Hitachi, Samsung, and SpeedPrint.Come in green, red, blue or silver; durometers may be customized by end-user.

Transition Automation, www.transitionautomation.com

goJTAG demonstration kit contains PicoTAP USB 2.0-controlled boundary scan controller and specific demo board for practical exercises. The open-source project provides IEEE 1149.1 training software that can be run in both simulation and online modes. Enables numerous graphical displays on various levels. In online mode, users can use software for the demo board for individual projects without restrictions. Software includes simulation components that reveal every single bit movement along the scan chains with single TCK precision; are able to step-wise control TAP states and observe system's reaction in real time as an on-screen simulation.

Goepel electronic, www.goJTAG.com