IRVINE, CA – TopLine’s CEO Martin Hart has been awarded a US patent for a fixture designed to deliver 1752 solder columns onto a substrate as part of the ceramic column grid array (CCGA) assembly process.

The patent was awarded Feb. 4.

TopLine’s CCGA column grid array IC packages are made with non-collapsible solder columns for surface mount soldering on PCBs and provide more compliancy than solder balls to absorb stress and increase solder joint reliability under harsh operating conditions.

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