AUSTIN, TX – The fan-out wafer level package (FO-WLP) market is projected to grow 15.5% in units from 2020 to 2024, according to TechSearch International.

Growth is expected to be driven by use in mobile devices such as smartphones and smartwatches, automotive radar, and increasing adoption in high-performance computing.

Wafer shipments are driven by adoption in AI accelerators, GPU/CPU, and networking applications with increasingly large areas. Foundry and OSAT players are introducing new versions. Alternatives include silicon interposers, embedded bridge, and RDL interposers.

Register now for PCB West Virtual 2020, the leading conference and exhibition for the printed circuit board industry, coming next week.  pcbwest.com  

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