BANNOCKBURN, IL — The best technical conference paper of IPC Apex Expo 2021 is “Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction” by Sarah Czaplewski, IBM.

Coauthors were Roger Krabbenhoft and Junyang Tang, IBM. This paper will be presented Mar. 11.

Two papers were selected in the honorable mention category, including “Board Thickness Effect on Accelerated Thermal Cycle Reliability” by Joe Smetana, Nokia. Coauthors were Richard Coyle, Nokia; Eric Lundeen, BAE Systems; Iulia Muntele, Sanmina; Scott Danko, TTM; Neil Hubble, Akrometrix; and Bev Christian, HDPUG. This paper will be presented Mar. 10.

Honorable mention also goes to “Analyzing Printed Circuit Board Voiding and other Anomalies when Requirements Covering the Anomalies are Vague” by Hailey Jordan, The Charles Stark Draper Laboratory. Coauthors were Wade Goldman and Curtis Leonard, The Charles Stark Draper Laboratory. This paper will be presented Mar. 10.

Members of the IPC Apex Expo Technical Program Committee voted via ballot. The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing, as well as value to the industry.

Authors will be recognized during show opening remarks on Mar. 9.

To register for IPC Apex Expo, visit www.IPCAPEXEXPO.org.

PCB EAST: The original East Coast technical conference and exhibition! Returning to the Boston suburbs in June 2021!

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