TAOYUAN CITY, TAIWAN – MacDermid Alpha Electronics Solutions opened its Greater China Die Attach Application Center here on Apr. 1. The advanced technology and application center will house technical service and lab personnel, equipped with die attach assembly and process equipment.

“With MacDermid Alpha’s unique role as a leading packaging materials supplier to all steps of the electronics manufacturing supply chain, this multimillion dollar investment to build a leading-edge application center is an important next step in enabling our customers to meet their design goals,” said Rick Frick, VP and GM of the Semiconductor Solutions division. “With these new capabilities, we will foster not only local, but also regional development of advanced die attach applications and high-volume manufacturing processes. Additionally, the facility enables collaboration of MacDermid Alpha’s suite of technologies, including IC substrate processes, advanced assembly polymers, metals and fluxes and wafer metallization in a way that optimizes every material within an electronic device.”

The center houses die attach assembly and testing equipment for high-volume process optimization and component designs using paste and film products. The second floor also has a panel-level packaging applications laboratory with capabilities to test solder balls, micro-solder spheres, reflow metrology, and a tool for wafer-level tin bumping. Production-scale wet processing equipment lines are located on the third floor, along with a chemical analysis laboratory containing high-precision instruments.

“We are confident through these investments and new capabilities that we can assist regional companies in achieving their goals and allow new advancements in the semiconductor industry as a whole,” said Jack Mook, GM APAC, Semiconductor Solutions.

PCB EAST: The original East Coast technical conference and exhibition! Returning to the Boston suburbs in June 2021! 

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