SINGAPORE – A*STAR’s Institute of Microelectronics (IME) is collaborating with four companies to form a system-in-package (SiP) consortium, say reports. IME will team with Asahi-Kasei, Globalfoundries, Qorvo and Toray to develop high-density SiP for heterogeneous chiplet integration for 5G and other applications.

The program will address the firms’ market requirements to integrate multiple system functions at the package level and achieve advanced SiP. Consortium members will apply 3-D integration technologies to miniaturize RFFE modules for 5G applications.

“Together with our consortium members, we are committed to bringing advanced packaging solutions to the next level. IME’s deep capabilities in 3-D integration technologies will help accelerate the development of heterogeneous chiplet integration in high-performance computing, 5G and AI applications to advance the semiconductor industry,” said Dim-Lee Kwong, executive director of IME.

“Globalfoundries is delighted to participate in this SiP Consortium for heterogeneous chiplet integration where chips fabricated using Globalfoundries’ advanced technologies will be integrated using new SiP technologies to miniaturize RFFE modules for 5G applications,” said Siah Soh Yun, Ph.D., VP, TD, Globalfoundries.

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