IPC Apex Expo 2023 Issues Call for Participation
BANNOCKBURN, IL — The newly appointed IPC Apex Expo Technical Program Committee is inviting engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts for IPC Apex Expo 2023, to be held at the San Diego Convention Center Jan. 24-26, 2023.
Technical conference paper and poster abstracts are due June 20. IPC seeks abstracts summarizing original and previously unpublished work describing significant results from research experiments, highlighting new techniques or materials, and/or discussing cutting-edge trends and challenges facing the electronics manufacturing industry.
“The TPC – comprised of top technical leadership and subject matter experts from across the electronics industry – continues to build and strengthen the IPC Apex Expo technical conference,” said Matt Kelly, IPC chief Technologist. “A new committee chair and co-chair are leading the group through process improvements with a focus to provide stronger technical content spanning various technologies and the supply chain. The TPC’s mission is to deliver strong, relevant and valuable technical programming that balances conventional technology advances with next-generation disruptive technologies. With these upgrades to the TPC, I’m excited to see what the IPC Apex Expo 2023 technical conference has in store.”
Led by Stanton Rak, Ph.D., SF Rak (chair) and Udo Welzel, Ph.D., Robert Bosch (co-chair), the committee comprises the following members: Beverley Christian, Ph.D., HDP User Group; Bhanu Sood, Ph.D., NASA Goddard Space Flight Center; Eric Campbell, IBM; Hans-Peter Tranitz, Ph.D., Continental Automotive; Jason Keeping, Celestica; Kelly Scanlon, IPC; Martin Goetz, Northrop Grumman; Matt Kelly, IPC; Michael Ford, Aegis Industrial Software; Michael Carano; Milos Lazic, Indium; Paige Fiet, TTM Technologies; Paul Cooke, Asahi Glass; Radu Diaconescu, Swissmic; Robert Kinyanjui, Ph.D., John Deere Electronic Solutions; Sarah Czaplewski-Campbell, IBM; Tim Burke, Ph.D., Arch Systems; Todd MacFadden, Bose; Laura Cohen, Ph.D., Continental Automotive; John Bauer, Collins Aerospace.
To submit an abstract, visit www.IPCAPEXEXPO.org/CFP. For more information, contact Julia Gumminger at CallForParticipation@ipc.org.
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