PEACHTREE CITY, GA -- CIRCUITS ASSEMBLY is accepting entries for its 2023 New Product Introduction Awards for electronics assembly equipment, materials and software suppliers.
Colloquially referred to as the Engineer’s Choice Awards – a nod to the background and independence of the judges – the 16th annual NPI Awards recognize the leading new products for electronics assembly during the past 12 months. Recipients are selected by an independent panel of practicing industry engineers and are presented by CIRCUITS ASSEMBLY.
The 2022 winners included Arch Systems, CyberOptics, Europlacer, #EVSInternational, Heller Industries, Indium Corporation, Juki Automation Systems, Koh Young America, KYZEN Corporation, OMRON Group, 1 Click SMT Technology Co.,ltd, #PSASystems, Scienscope International, SPEA, and VJ Electronix.
How It Works
Entrants must submit a single registration form for each product and category entered. All entries must include a 250- to 1,000-word statement describing the product in the following terms:
Evaluations will be based on the above list.
The entry fee is $500 per product. The deadline for entries is Oct. 28, 2022.
To be eligible, entries must have been introduced to market (any region) no earlier than Jan. 1, 2022.
Equipment: automation tools (conveyors, feeders, etc.); bonders; cleaning equipment; component placement - high-speed; component placement - multifunction; component placement - accessory technologies; component storage; device programming; dispensing equipment; labeling equipment; process control tools; rework and repair tools; screen/stencil printing; screen/stencil printing peripherals/consumables; soldering - reflow (convection); soldering – wave; soldering – selective; selective soldering tools and accessories; soldering – alternative (vapor phase, hot bar, laser, etc.); soldering – hand tools; test and inspection – AOI; test and inspection – AXI; test and inspection – ICT; test and inspection – SPI; test and inspection – functional test; first article inspection; curing ovens (for non-solder materials); ESD
Materials: adhesives; cleaning materials; coatings/encapsulants; underfills; thermal interface materials; flux; soldering materials (paste, bar, wire, core, etc.); cored wire
Software: software – process control; software – production; software – management (ERP, MRP, etc.)
Process Innovation (EMS only)
For more information, visit https://lnkd.in/dcUXVy7U.
Register now at https://lnkd.in/de7NMdjM.