Bluster, manipulation and gaslighting – all in a week’s work.

“... 90 percent of the startups founded by dweeby young men in San Francisco are simply trying to answer the question: ‘What things isn’t my mom doing for me any more?’ Creating a frictionless future seems to mean launching speedy meal delivery, dog walking, and laundry apps. ‘There is a tendency in Silicon Valley to want to be revolutionary without, you know, revolutionizing everything ...’ Too many moonshots are still sputtering on the launch pad. It is not yet clear that innovations such as social media, cryptocurrencies, or the metaverse yet represent any net positive for humanity. As skeptical economists never tire of pointing out, the digital revolution has so far had little quantifiable effect in lifting productivity.”

– John Thornhill, Financial Times

“Money talks, but it doesn’t tell the truth.”

“Time heals all wounds, right up to the moment that it kills you.”

– Herbie Cohen

And still they come.

MES upgrades capture kanban inventory levels, allowing electronic replenishment pulls.

The visual factory has come a long way since the concept was introduced, moving from production status viewable by walking the factory floor to a comprehensive collection of real-time data viewable from any interconnected computer. That evolution isn't seamless for many electronics manufacturing services (EMS) providers, however. While newer equipment platforms are designed to integrate with manufacturing execution systems (MES) easily, legacy equipment platforms may require specialized programming or other workarounds to achieve desired interoperability. Equipment communication incompatibilities often lead to multiple shop floor control systems being utilized among work areas, which is inherently inefficient.

SigmaTron International's Chihuahua, Mexico, facility recently dealt with these issues when the facility began transitioning to the company's proprietary Tango MES. The company's corporate IT and operations teams have worked together to define enhanced shop floor capabilities in production and are upgrading system capabilities across facilities. The challenge for facilities implementing the latest enhancements is creating efficient equipment interfaces and integrating or replacing legacy processes.

AI could be the key to understanding the data collected by the IoT.

Big data is useless and all the sensors in the world are not enough. Contentious? Maybe. I've talked in the past about the prospects for digitizing the world and it's true that we have many of the ingredients to make this happen: tiny, low-power sensors including optical and MEMS inertial sensors that provide contextual awareness; connectivity technologies for almost every practical and budgetary constraint; low-cost processing power and mass storage.

We're well on the way to seeing almost 30 billion devices connected to the IoT in the next couple of years, and there is no practical limit to this. We have enough IPv6 addresses to cover the earth's surface many times over with smart "things." We can easily collect the data we need to digitize the world.

The bigger challenge is to understand what that data are telling us and, from there, determine suitable responses. The sheer volume, velocity and variety of data we can now capture through IoT devices easily exceed the capacity of humans to analyze and extract meaningful insights manually. AI is the perfect companion to the IoT, capable of providing the assistance we need. Bringing them together as the AIoT is the key to tackling complex challenges such as sustainability. Studying the climate and humans' impact, the effects of using natural resources such as energy, and the prospects for controlling and managing these are subject to huge numbers of variables that are impossible for us to analyze effectively.

ECTC revealed the latest developments in 3-D hybrid bonding.

More than 50 presentations on hybrid bonding filled rooms to capacity at the IEEE Electronics Components and Technology Conference (ECTC) in Orlando, as did the Tuesday morning panel session. That panel discussion, on "Copper Hybrid Bond Interconnections for Chip-to-Wafer Applications," organized by Infinera and Qualcomm and moderated by TechSearch International, included perspectives from design and EDA (Synopsys) and research institute IMEC, users of hybrid bonding (AMD with production at TSMC and Intel with its internal development program), equipment makers Besi and EVG, and yield and reliability specialist PDF Solutions.

Synopsys pointed out the importance of design tools and IMEC described key drivers for 2.5-D and 3-D integration technologies such as increasing system complexity, increasing need for heterogeneous integration, increasing die-to-die interconnect data bandwidth (more interconnect channels and higher interconnect speeds per interconnect), reducing die-to-die interconnect energy with shorter distance interconnect, scaled, lower capacitance interconnects, and lower voltage. IMEC noted the issue is not the number of interconnects but rather the available (local) interconnect density enabled by interconnect pitch scaling. Many of today's hybrid bonding applications using die-to-wafer structures are focused on the high-performance space where the cost can be justified, including stacking SRAM cache and logic-on-logic, as introduced by AMD's products in desktop, servers, and AI/machine learning.