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Features Articles

Seemingly small issues can have big print implications.

Most reading this column are probably familiar with "The Princess and the Pea" fairy tale by Hans Christian Andersen, wherein a tiny pea under 20 mattresses keeps a true princess from a good night's sleep. Similarly, in the stencil printing process, seemingly small settings or interferences can prevent a good print outcome – particularly as assemblies continue to move toward higher densities and miniaturization. Our team had such a scenario recently while troubleshooting the cause for incomplete deposits on a complex board assembly.

This project involved printing on ultra-thin substrates – approximately 400µm thick. That's about the thickness of a playing card, so very, very thin, which makes for challenging print stability. Moreover, the panel was on the larger side, about 400mm x 400mm made up of multiple PCBs with no routing, making it more difficult to ensure coplanarity during printing. Tooling stability is always critical and even more challenging with very thin substrates. Today's tooling support solutions number a handful of options: Equipment standard tooling pins, reconfigurable pin systems like Grid-Lok, smart automatic pin placement, and dedicated tooling blocks with and without vacuum. Given the size and thickness of this substrate, our team used dedicated tooling blocks with vacuum to offer the most robust support for the process analysis.

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Proper fab specs can prevent a deluge of engineering questions.

I have been selling bare printed circuit boards for over 30 years to a variety of customers who order a wide selection of PCBs. The most common complaint I hear from board buyers is about the number of engineering questions (EQs) asked whenever a new order is placed, or when a part number is moved from one supplier to another.

"Why can't you build the boards without all these questions?" they ask. "We sent you the working files!"

To many buyers, the inevitable EQs that come along with moving a PCB order to a more cost-effective supplier seem daunting. Sure, the new pricing may be great, but many PCB buyers will delay switching to a new supplier because they don't want to deal with engineering questions from the new fabricator.

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Our newest column shares tips and tricks and lessons learned over 30 years in PCB design.

With today's complex printed circuit board (PCB) designs challenging us at almost every stage of the design process, along with shortened project schedules and shrinking budgets, achieving success is no easy feat. Smaller component packages, faster signal edge rates or rise times, and increased design for manufacturing (DfM) challenges all make it difficult to achieve success and get product to market on time and under budget. The foundation for achieving success is understanding PCB design (the full design process) and mastering the power of today's EDA tools.

Even so, design teams can lose valuable time on unproductive tasks. Designers need a collaborative approach to electronic systems design that keeps them connected through all engineering disciplines and gives them best-in-class solutions to handle complexity across the entire PCB design process.

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Remember to sell the excitement of the industry.

As finding and hiring talent has become so difficult over the past several years, it seems in every conversation I have, especially when younger people are involved, the subject turns to the need for talent in the world of manufacturing. With the baby boomers retiring in record numbers and the millennial generation showing so little knowledge of, or interest in, manufacturing, while appearing to prefer a "gig" type of employment (read: it's just a temporary job), my mantra of talking about the needs of industry for new talent at times seems like a broken record.

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Is the next generation of designers honing its skills on Minecraft?

If there were a record for the longest wait for a technology to take off (longest gestation period for a new technology), then virtual reality must surely be a top candidate for the honor. As long ago as 1990, the movie Total Recall gave mainstream audiences a dystopian view of the way life could be. The intervening three decades have cemented the image of the headset-wearing gamer in our minds – totally immersed in the experience yet oblivious to all around. And still it has failed to gain a large-scale following. Until now, perhaps.

With equipment sales currently rising at about 14% per annum according to research by IDC, all the big consumer technology brands are planning major new product launches in the coming months. Growth should accelerate to more than 30% in the next five years.

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A DoE reveals the packaging type matters less than the process used.

The need for electrostatic discharge (ESD) protection is drilled into production workers from day one in most electronics manufacturing facilities. Most facilities have multiple layers of protection including floor tiles or conductive coating, smocks, individual grounding devices, ESD mats on workstations, and ionizing blowers throughout the production process. There are also multiple layers of protection from conductive totes to metalized bags for product as it ships out. There is a tendency to believe more protection is always better. Given that the seven wastes include both defects and overprocessing, however, from a Lean manufacturing standpoint there is value in analyzing how much protection is required for shipped products. Considering whether multiple layers of protection create a false sense of security with operators involved in pack/unpack operations also has value.

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