Tips for adjusting to changing customer forecasts.

The EMS industry is running true to a cycle no one likes: big drops in demand following a period of inventory buildup. The drivers for inventory buildup were material constraints and unpredictable spikes in demand following the Covid lockdown period. OEMs increased both raw materials and finished goods in their desire to stay ahead of parts shortages and customer spending sprees. Unfortunately, our heated economy is finally slowing. While consumer spending has remained strong, they are tightening their belts on big purchases and purchasing fewer discretionary items.

As a result, electronics manufacturing services (EMS) providers are seeing a different set of issues than they have been dealing with the past two years. Material inventories are still high and forecasts are dropping as customers slow down new orders to burn off existing finished goods inventories. How do you counter these challenging trends? There should be three areas of focus:

Government-funded organization hopes to knock down barriers to commercialization.

The American Vacuum Society (AVS) held its annual conference in Portland, OR, with roughly 2,000 in attendance for the November meeting. The conference included many technical presentations by students, faculty and industry on cutting-edge issues associated with materials, processing and interfaces.

Among the highlights this year was a special session on the Chips Act. The session on the Chips and Science Act Implementation for Microelectronics (including workforce) was moderated by Dr. Alain Diebold, SUNY Polytechnic Institute, and Dr. Tina Kaarsberg, US Dept. of Energy Advanced Manufacturing Office.

The first invited talk was given by Dr. Jay Lewis, director, National Semiconductor Technology Center (NSTC). NSTC is a public/private consortium authorized and funded by the US government to serve as the focal point for research and engineering throughout the semiconductor ecosystem, advancing and enabling disruptive innovation to provide US leadership in the industries of the future. Dr. Lewis announced the incorporation of a new nonprofit entity, SemiUS, to operate the NSTC. SemiUS will work in partnership with the US Department of Commerce to develop and implement a wide variety of programs to fulfill the mission of the NSTC consortium. The focus is on building a strong semiconductor research and development ecosystem in the United States.

Fine tuning the timing of net groups.

When faced with a microcontroller and a companion memory chip, to unravel the crossed-over connections while maintaining high quality microstrip and stripline connections can be a daunting task. Add in the requirement around the time of flight for a typical memory bus or other family of high-speed connections, and you can spend considerable time sorting out that nest of interconnections.

As PCB designers, we go to great lengths to meet the requirements for additional air gaps around transmission lines. Isolating one trace from another becomes more important as the overall length of the traces grows. Crosstalk is a function of how far two traces run parallel to each other at a given distance apart. So, ultimately it is more than the minimum air-gap in play. The length of the boundary also matters.

With a number of connections that start in one general area and end at some other location, it’s easy to picture a river of traces running from here to there. The variance in length between any of the routes is small compared to their total length. Any traces on the long side get pulled tight to minimize their natural length. From that point, the traces that end up too short get some meanders along the way.

AI factories could be the next step for smart manufacturing.

Joined-up thinking is a concept that can deliver a multitude of benefits. Where there are many differing interests to satisfy, bringing together ideas and coordinating actions in a holistic approach can lead to a better outcome for all. Not the least, it can reduce duplication of efforts and resources, making processes more streamlined and cost-effective.

In practice, joined-up thinking is often difficult to achieve. Institutional barriers, differing priorities among stakeholders, and the sheer number and diversity of variables to evaluate and manage can conspire to thwart the best intentions.

Manufacturing is a complex sequence of events that demands substantial joined-up thinking simply to make it happen and see a result coming off the production line. Increasingly, however, this is not enough in the modern world. Numerous related factors must be considered, especially the environmental impact of our activities. Smart manufacturing has enabled us to address some of these issues, connecting the factory and IT domains and bringing manufacturing data into enterprise systems to enhance planning and historical analysis for continuous improvement. This is joined-up thinking 2.0, if you like.