It might be time for a 50-year-old concept to catch on in PCB fabrication.
Back in 1978, at the first Printed Circuit World Convention in London, the proceedings described a novel additive technique for producing printed circuit boards on epoxy glass-based laminate. It was a complete contrast to the subtractive approach that was typical at the time and still dominates today. Now, as we strive to achieve ever finer circuit geometries, and sustainability of manufacturing processes has become a prime concern, additive processes could offer a way forward.
Among the most intriguing applications I’ve seen, 3-D printing of twisted-pair interconnects is unlikely to be adopted as a high-volume manufacturing technique but could prove extremely useful for maintenance and repair.
It’s getting closer, but not there yet.
Quoting printed circuit boards – especially for high-mix, low-to-medium volume requirements – can be extremely time-consuming and, at times, mentally challenging. That’s especially true in these days of frequently changing tariffs, when many prospects are just kicking the tires in search of better pricing.
I have found many US PCB fabricators slower than their offshore counterparts in responding to requests for quotes. But that’s not from lack of trying. Between balancing innerlayer stackups, calculating specialty via drill costs, and accounting for ever-changing material prices, quoting a bare board isn’t just a spreadsheet task anymore.
These two skills make for a good negotiator.
Dual responsibility for company profitability and customer satisfaction makes program management among the most difficult jobs in EMS. While the program manager is responsible for coordinating the resources of EMS production on behalf of their customers, most have no authority over the people who control those resources. Program managers who excel in negotiation accomplish more than those who don’t.
Rebuilding the industrial base will take time and commitment.
There has been a lot of talk, chatter, posturing and proclamations by pundits and politicians alike about the soon-to-be American manufacturing renaissance. Usually, when so much hoopla surrounds a topic, the result resembles the famous Aesop warning: “After all is said and done, more is said than done!”
Forecasts, fires and false hopes: Are you ignoring the heat?
What do you do when your train is on fire?
Imagine you are at a train stop. The train you want to board pulls up and it is on fire. What do you do?
Despite early warnings and smoke in the air, some electronics manufacturing services (EMS) companies seem to ignore the looming train fire. The results can be disastrous.
What are some of those early train fire signals?
Progress for glass-core substrates and RDL interposers highlighted ECTC’s 75th anniversary conference.
More than 2,500 attendees braved the stormy Texas weather to discuss the latest developments in packaging and assembly at the IEEE Electronics Components and Technology Conference (ECTC) in May. Among the many presentations were a number focused on high-performance packaging, with clear momentum for expanded use of molded redistribution layer (RDL) packages, wafer-level packaging and updates on the states of glass core substrates. IBM announced its license of Deca’s RDL technology and outlined production plans for North America. Many presentations described progress in hybrid bonding and co-packaged optics, while others highlighted thermal challenges and metrology needs.