Silicone-based thermal interface material supports heat dissipation in optical modules, dense electronics and high-speed data applications. DOWSIL TC-3120 Thermal Gel provides thermal conductivity of approximately 12W/m·K and is designed to minimize oil bleeding and condensed outgassing to help maintain optical-grade cleanliness. Flowable, one-part material supports minimum bondline thicknesses of 200µm, fills large gaps and can be reworked after curing. Designed for 800G and 1.6T optical modules, telecommunications equipment, electronic module assemblies, autonomous vehicles and automotive electronic controllers. Material resists thermal cycling, shock, vibration and slumping in vertically oriented assemblies while supporting module-to-heatsink interfaces with uneven surfaces or tolerance stackups.

TNC Series thick-film NTC thermistors provide temperature sensing and monitoring for automotive, industrial, battery management and medical electronics applications. Available in 0402, 0603 and 0805 case sizes, the series offers resistance values from 50Ω to 500kΩ, B values from 2410K to 4700K, and operating temperatures up to 150°C. Devices use thick-film technology to improve mechanical strength, maintain consistent thickness across resistance values and enhance resistance to cracking compared with multilayer thermistors. Components feature strong solderability, fast thermal response, heat resistance and AEC-Q200 qualification for demanding environments.

Stackpole Electronics introduced the HCC series high-current busbar shunts for battery electric and hybrid vehicle current sensing applications. Designed for battery management systems, DC bus measurement and inverter output current monitoring, the series supports current handling above 1400A with resistance values of 100, 50 and 25µOhm. Features all-welded construction for mechanical durability and linear current measurement output across high-current EV subsystems. Available in multiple package sizes and resistance values, the shunts are intended for scalable EV and hybrid power system designs. Stackpole also offers custom sizes, shapes and resistance values through its vertically integrated manufacturing operations.

Henkel expanded its Technomelt portfolio with the PA 6370 low-pressure molding material for electronic assemblies requiring fine-gap filling and environmental protection. Polyamide-based hot melt formulation supports gap penetration down to 0.5mm with ultra-low melt viscosity from 2700–3000mPa·s at 210°C and 1065–1180mPa·s at 240°C. Material provides adhesion stability across multiple substrates and passed lap shear testing after 1,200hr exposure to 85°C/85% RH conditions. Technomelt PA 6370 meets UL 94 V-0 flame retardancy requirements and offers electrical insulation properties with a coefficient of thermal expansion of 175ppm. Operating temperature range spans -20°C to 140°C. Henkel said the material supports low-pressure molding processes with cycle times as low as 30 sec., targeting faster encapsulation compared to conventional potting approaches.