Hint: A good process might be enough.

Nitrogen in reflow soldering is often seen as a performance enhancer – offering improved wetting, shinier joints and fewer defects. It’s not always necessary, however. While nitrogen can deliver real process benefits, it also adds cost, complexity and infrastructure requirements. In many cases, good materials and proper process control are enough to deliver reliable results in air. So, when does nitrogen actually make a difference? And when is it just added overhead?

How Siemens lowered its PCB assembly defect rate through linked data analysis.

The introduction of causal AI has opened a new chapter in PCB production. As part of a proof-of-concept project, the Siemens Motion Control plant in Erlangen, Germany, successfully reduced the error rate in PCB production to below the demanding Six Sigma wall. This achievement demonstrates how holistic data analysis and AI-supported root cause analysis can optimize production standards (Figure 1). As a pioneer of digital transformation, Siemens leverages causal AI to revolutionize production processes. By seamlessly linking and analyzing all data across the entire value chain, they achieve a new level of transparency and efficiency. The result: optimal product quality, cost savings, accelerated processes and a decisive competitive advantage.

What you don’t test can hurt you.

One of the most important steps in printed circuit board production is testing. If PCBs aren’t tested, errors and defects missed during the manufacturing process could eventually lead to malfunctions and product failures in the field. After a PCB board is manufactured and assembled, it is tested to ensure no shorts or opens are in the PCB circuitry. All components must be verified for the correct values per the design, proper orientation, and be free of faults (or dead). Inspecting the solder quality of through-hole (PTH) connector leads, large surface-mount technology (SMT) ICs and the balls of a ball grid array (BGA) package can be difficult with standard inspection tools and methods. These verification processes are highly challenging and require a full understanding of the design scope of ECAD tools and the mechanical capabilities of the testing equipment.