PCB2Day Workshop Series
Hirose Launches IT18 Series COM-HPC Compatible BGA Mezzanine Connector
Hirose launched the IT18 Series COM-HPC compatible BGA mezzanine connector supporting PCIe Gen5 (32GT/s), PCIe Gen6 (64GT/s PAM4) and 100Gb Ethernet (4×25Gb) transmission for high-density embedded and industrial applications. Connector features 400 positions on a 0.635mm pitch in a low-profile design with 5mm and 10mm stacking heights. Open pin field grid array design enables flexible routing of signals, grounds, and power for signal integrity optimization and varying layout requirements. Connector incorporates crosstalk suppression technology, including far-end crosstalk cancellation and utilizes a metal cap structure to reduce warpage and protect contacts during reflow. Additional features include retention tabs to reduce solder ball cracking risk, pin-in-ball soldering structure, and alignment guides for mating reliability. Designed for industrial automation, medical imaging, and test and measurement equipment applications.
Hirose
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