Monthly report tracking billings and bookings (book-to-bill) worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices (does not include billings and bookings of semiconductors). Categories covered include front-end (wafer processing/mask/reticle/wafer manufacturing/fab facilities) equipment and final manufacturing (assembly/packaging/test) equipment. Data are provided on a 90-day moving average basis. This is considered a leading indicator of future printed circuit board and electronics assembly orders. Compiled by Semiconductor Equipment Association of Japan, SEMI and SEMI Japan.

• Q1 2022
• 2021
• 2021
• Q3 2021
• Q2 2021
• 2021, 2022
• Q1 2021
• 2020
• 2020
• Q3 2020
• August 2020
• 2020, 2021
• 2019
• 2019, 2020, 2021
• Q3 2019
• Q1 2019
• 2018
• 2018
• Q3 2018
• 2018 and 2019
• Q1 2018
• 2017
• 2018
• Q2 2017
• 2017, 2018 (Fab spending, SEMI)
• 2016 (Semiconductor Capital Equipment Spending, Gartner)
• 2016 (Gartner)
• 2015 (Gartner)
• Nondestructive Testing Equipment 2021
• 2015-16 (SEMI/SEAJ)
• Q3 2015 (SEMI/SEAJ)
• 2015, 2016 (SEMI)
• Q3, 2014 (SEMI/SEAJ)
• Q2 , 2014 (SEMI/SEAJ)
• 2020 ATE forecast (MarketsandMarkets, October 2014)
• 2014 forecast (SEMI, July 2014)
• Q1, 2014 (SEMI/SEAJ)
• 2014 forecast (Gartner)
• 2013-2015 (SEMI)
• 2013, final worldwide (Gartner)
• 2013-17 (Gartner)
• 2018 Forecast (October 2013) (Global Industry Analysts)
• H1 2013 and 2014 Forecast (September 2013)
• 2013 (September 2013)
• Q2 2013
• July 2013
• 2013-14 (July 2013)
• Q1 2013
• 2013-15 Forecast (June 2013)
• 2013 Forecast (March 2013)
• 2012 Final
• Q3, 2012
• 2012 Sales Forecast (December 2012)
• 2013 Forecast (September 2012)
• Q2, 2012
• 2012-2013 forecast (July 2012)
• 2012-2013 forecast (June 2012)
• Q1, 2012
• 2012-13 forecast (November 2011)
• Q3, 2011
• 2011-12 forecast (September 2011)
• Q2, 2011
• Q1, 2011
• 2011 forecast (June 2011)
• 2011 forecast (February 2011)
• 2010 final
• Q3, 2010
• Q2, 2010
• Q1, 2010
• 2009 final