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Zestron Eye monitors wash bath concentration in the presence of flux loading. Consists of sensor and digital controller that displays concentration in real time. Fully integrates with commonly used cleaning machine types by leading manufacturers. For use with Zestron cleaning agents.

Zestron, www.zestron.com

Tags: Zestron, PCB cleaning, flux, wash bath monitor

Zestron Eye monitors wash bath concentration in the presence of flux loading. Consists of sensor and digital controller that displays concentration in real time. Fully integrates with commonly used cleaning machine types by leading manufacturers. For use with Zestron cleaning agents.

Zestron, www.zestron.com

Tags: Zestron, PCB cleaning, flux, wash bath monitor

Direct Board Interconnect Technology (DBiT) process for terminating lead wires or flexible circuits directly on to a PCB eliminates connectors, while producing a high quality connection. Performs direct connection of wire, component lead, or flex circuit via a crimping system. Requires no soldering. Continuous-feed splicing material process.

Autosplice, autosplice.com

Model S1 mkII solder paste inspection system performs high-speed 5D inspection (simultaneous 2D and 3D inspection). Re-engineered inspection head has improved 2D image capture. Patented sensor technology simultaneously combines 2D and 3D image processing, reducing inspection tolerances. True area, shape, volume, offset and height measurements provided in combination, for process control.

MEK Europe, www.mek-europe.com

TAGS: MEK, solder paste inspection, AOI, printing, SPI, SMT

 

Model S1 mkII solder paste inspection system performs high-speed 5D inspection (simultaneous 2D and 3D inspection). Re-engineered inspection head has improved 2D image capture. Patented sensor technology simultaneously combines 2D and 3D image processing, reducing inspection tolerances. True area, shape, volume, offset and height measurements provided in combination, for process control.

MEK Europe, www.mek-europe.com

TAGS: MEK, solder paste inspection, AOI, printing, SPI, SMT

 

CA-102 conductive adhesive, for bonding components to circuit boards, has a moderate glass transition temperature (Tg) and modulus. Rheology is optimized for screen printing and can be needle-dispensed by time-pressure, auger or positive displacement. Provides conductivity stability during damp heat testing on tin, silver and copper surfaces. For requiring lower-stress, lower-temperature processing or Pb-free applications

Engineered Material Systems, www.emsadhesives.com

TAGS: conductive adhesive, Engineered Material Systems, SMT, electronics assembly, printed circuit board

 

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