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SP50 for 3-D solder paste inspection features full volume, height, area and registration measurements. Speeds reportedly up to 38.7cm²/sec. Handles boards up to 19.5 x 19.5”. Features Agilent head swap technology, which permits alternating equipment from an SP50 to an SJ50. Has optical encoders and linear motors. speeds may vary depending upon application. Has scalable 6 μm per pixel resolution and 4 μm height resolution.

Agilent Technologies, www.agilent.com

The 781RC MicroMark Recirculating Spray System is said to reduce maintenance and downtime associated with conventional marking systems. Uses a recirculating pump to keep pigments in suspension and a short burst of air after each cycle to clear the nozzle of any residue. Applications include components to printed circuit boards.

EFD Inc., www.efd-inc.com

Thermoset MA-511 is a one-component thixotropic epoxy material for use as an adhesive or sealant in microelectronic applications requiring high-speed dispensing. Is said to be a reworkable, low-modulus, non-slumping dispensing adhesive for cap sealing. Cures rapidly, offers adhesion to a variety of plastics; thixotropic rheology permits shape to be maintained after dispensing.

Lord Corp., www.lord.com

NS-F850 rosin-based flux for lead-free wave soldering ensures wetting and hole fill, and facilitates solder drainage to minimize bridges and icicles. Is said to prevent solder balls from adhering to solder mask. Matte finish facilitates inspection after soldering.

Nihon Superior, www.nihonsuperior.co.jp

FLEXconveyor is a box-build factory on wheels, providing a way to kit and assemble products. Permits unclamping and re-clamping of any section of the conveyor line at any time.

Bliss Industries, www.blissindustries.com

Rehm Pyrolysis is a low-maintenance residue management system deployed within the heating zones of VXP convection reflow ovens. Thermally induces decomposition of organic compounds. Complex molecules are broken down into simpler substances with the use of high temperatures (500°C-900°C) taking place in a largely oxygen free (anaerobic) environment to avoid burning. Remaining residues are then captured within a special granulate. Granulate exchange required at 12-month intervals.
Rehm Thermal Systems, www.rehm-group.com