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PF735-P267J low melting point lead-free solder paste is designed for jetting. Offers excellent workability and solderability for automatic high-speed jetting production.

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V9 low-voiding, no-clean solder paste is formulated to reduce voiding to as low as 1% on BGA and <5% on BTC components, while exhibiting stable print performance on fine-feature devices over 12 hr.

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Alpha HRL3 solder sphere is a lead-free, high-reliability, low-temp. alloy for ball-mount applications.

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EO-S-002 solar flux has 2% solids and low resin content.

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Advanced tilt and rotate dispensing system is available for Camalot Prodigy. Reduces wet-out areas and improves capillary flow for underfill.

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DUT Scale Duo Interface for V93000 EXA Scale SoC test systems is for testing advanced semiconductors.

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