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1911MK5-VR Nitrogen Vacuum Reflow Oven has 11 zones, a vacuum chamber, closed-loop nitrogen atmosphere control and Cool-Pipe flux management system, which traps flux so it can be removed and replaced while oven is running.

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EO-Y-006 A and C fluxes consist of 60% alcohol and 40% water.

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YRM20 high-speed modular mounter features high-speed rotary head that achieves up to 115,000cph. 

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PF735-PQ10-10 low-melting-point lead-free solder paste is capable of reducing reflow temp. to below 190°C, decreasing PCB and substrate deformation.

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Henkel Berquist Liqui Form TLF 10000 one-part, high thermal conductivity dispensable gel provides heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability.

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Table Top Digital Fringe Projection 2.0 (TTDFP2) provides fast and accurate surface topography for discontinuous surfaces at room temp.

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