1911MK5-VR Nitrogen Vacuum Reflow Oven has 11 zones, a vacuum chamber, closed-loop nitrogen atmosphere control and Cool-Pipe flux management system, which traps flux so it can be removed and replaced while oven is running.
YRM20 high-speed modular mounter features high-speed rotary head that achieves up to 115,000cph.
PF735-PQ10-10 low-melting-point lead-free solder paste is capable of reducing reflow temp. to below 190°C, decreasing PCB and substrate deformation.
Henkel Berquist Liqui Form TLF 10000 one-part, high thermal conductivity dispensable gel provides heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability.
Table Top Digital Fringe Projection 2.0 (TTDFP2) provides fast and accurate surface topography for discontinuous surfaces at room temp.