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AERIAL L4 is the latest addition to Seica's Pilot line, and is for customers who need to implement test strategies for prototype verification, pre-screen for manufacturing defects,and fault diagnostics after functional maintenance tests.
Being based on the VIVA Integrated Platform (VIP) it integrates the core VIP hardware and software, and is fully compatible with the other Seica test products including the PILOT Flying Probe, STRATEGY In-circuit and VALID Functional testers.
Uses four independent, mobile test probes to carry out tests on both sides of the UUT (two on each side). The vertical board clamping system is said to eliminate vibration of the board under test and allows a compact footprint. Offers a board test area of 24 x 24 in. (610 x 610 mm).
SEICA Inc., seica.com
Booth 2257
Being based on the VIVA Integrated Platform (VIP) it integrates the core VIP hardware and software, and is fully compatible with the other Seica test products including the PILOT Flying Probe, STRATEGY In-circuit and VALID Functional testers.
Uses four independent, mobile test probes to carry out tests on both sides of the UUT (two on each side). The vertical board clamping system is said to eliminate vibration of the board under test and allows a compact footprint. Offers a board test area of 24 x 24 in. (610 x 610 mm).
SEICA Inc., seica.com
Booth 2257
ZESTRON America will showcase its latest Pb-free cleaning services during Apex. The company will also feature recent advances in PCB, stencil/misprint and maintenance cleaning applications.
The applications technology and sales team will be available to answer precision cleaning questions.
As part of the conference’s technical sessions, Zestron’s Application Technology Manager, Umut Tosun, will discuss “Cleaning Lead-Free Prior to Conformal Coating? Risks and Implications.” The presentation will take place on Wed., Feb. 8 at 1:30: Quality Reliability and Testing.
Zestron America, zestronusa.com
Booth 1229
The applications technology and sales team will be available to answer precision cleaning questions.
As part of the conference’s technical sessions, Zestron’s Application Technology Manager, Umut Tosun, will discuss “Cleaning Lead-Free Prior to Conformal Coating? Risks and Implications.” The presentation will take place on Wed., Feb. 8 at 1:30: Quality Reliability and Testing.
Zestron America, zestronusa.com
Booth 1229
Multi-Seals offers a free engineering sample kit of Uni-form epoxy preforms. Includes a variety of epoxy preform configurations along with an information pack. Free evaluation samples in specified dimensions and epoxy systems are also available for specific applications. The preforms are an alternative to liquid epoxy for high-volume epoxy sealing applications.
Preforms are one-part epoxy resins that are solid at room temperature. When heated, they melt and cure, forming a consistent seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings and other contaminants. Close tolerances on preform configurations, consistent pre-mixed ratios of resin to catalyst and consistent viscosity from beginning to end of batch ensure uniform results.
Can be dispensed at 200 to 600 parts/min. with little or no operator training. Said to eliminate pot-life concerns and cleanup procedures.
Multi-Seals Inc., multi-seals.com
Preforms are one-part epoxy resins that are solid at room temperature. When heated, they melt and cure, forming a consistent seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings and other contaminants. Close tolerances on preform configurations, consistent pre-mixed ratios of resin to catalyst and consistent viscosity from beginning to end of batch ensure uniform results.
Can be dispensed at 200 to 600 parts/min. with little or no operator training. Said to eliminate pot-life concerns and cleanup procedures.
Multi-Seals Inc., multi-seals.com
LeadHound RoHS/Pb-Free Verification System will verify Pb-free or leaded components, sub-assemblies, PCBs and other items in as little as 15 sec.
Using micro-focus x-ray fluorescence (XRF), can detect the presence of lead, cadmium, mercury, chromium and bromine, as well as other elements, in a safe working environment and provide the percentage of each element found in a tested item. This enables shops to determine if an item complies with RoHS/WEEE directives or military and avionics specifications.
Can test several items in one session and generate a report for most requirements in 30 sec. Generates a report after each test that can be printed or stored as a file to meet applicable documentation needs.
In addition to testing boards and components, can detect lead in BGA spheres and solder paste in pots.
Can identify which items pass/fail the test and take appropriate action for a facility’s production requirements. In-depth reporting capabilities can tell the percentages or ppm of specified elements in each item.
Runs on a stand-alone, Windows XP-based computer. The x-ray system can be standardized at lunch or dinner breaks midway through production shifts. Power-up automatically initiates a standardization which takes approximately 3 min.
HEPCO, hepcoblue.com
Booth 1396
Booth 1396
Pentaplex Inc.’s High Energy Pulse Discharge capacitors reportedly set new standards of Low Equivalent Series Inductance and High Pulse Discharge Current. ESLs as low as 5 nanoHenrys and pulse discharge currents of 100,000 Amps have been achieved for a 100 KV 4.0 nanoFarad unit.
This was achieved by combining the oldest known inorganic dielectric, MICA, with a new proprietary manufacturing process based upon Pentaplex’s low-out gassing PCB technology at Fermi National Accelerator Laboratory.
Additional advantages: completely solid-state construction with no sealed containers to rupture or oil to leak. Form-factor is completely flexible; units can be custom made to thicknesses less than 1/2 cm for planar transmission line installation to a standard rectangular form factor to drop-in replace lower performance capacitors.
Temperature rating to 150°C thanks to the inert nature of the specially processed mica dielectric.
Range from 0.1 to100 nF and from 20,000 to 200,000 Volts.
Pentaplex Inc., pentaplexinc.com.
VIPx (Verifier Image Processor) is a PC/Windows XP-based Image Processor that delivers solder joint, package and PCB board level diagnostic software capabilities for visualization, precise measurement and user defined (pass or fail) analysis of SMT/BGA solder joints, PCBs, components, mechanical parts and electrical interconnections. Suitable for upgrading almost any x-ray inspection system, (manual or semi-automated) with PC-based functionality.
Application centric tool set focuses on key high-use features facilitated by wizard-driven diagnostic helpers. Algorithm-based inspection modules automatically find solder connections and perform measurement and defect detection by operator defined pass/fail analysis criteria. This collective image processing automatically finds failures at the solder joint level or selected regions of interest (voids, opens, shorts, ball size, ball shape,
etc.) by color-coded indicators. Data collection and e measurement reporting further isolate, quantify and document faults for corrective action.
Features a number of modules for BGA analysis, SMT analysis, custom analysis, package analysis, PCB analysis or image enhancement.
An extension of the VIP software series offered on Verifier, Concept FX and refurbished Nicolet x-ray equipment products. Can be added to any camera-based x-ray inspection systems offered in the industry.
Focalspot, focalspot.com
Application centric tool set focuses on key high-use features facilitated by wizard-driven diagnostic helpers. Algorithm-based inspection modules automatically find solder connections and perform measurement and defect detection by operator defined pass/fail analysis criteria. This collective image processing automatically finds failures at the solder joint level or selected regions of interest (voids, opens, shorts, ball size, ball shape,
etc.) by color-coded indicators. Data collection and e measurement reporting further isolate, quantify and document faults for corrective action.
Features a number of modules for BGA analysis, SMT analysis, custom analysis, package analysis, PCB analysis or image enhancement.
An extension of the VIP software series offered on Verifier, Concept FX and refurbished Nicolet x-ray equipment products. Can be added to any camera-based x-ray inspection systems offered in the industry.
Focalspot, focalspot.com
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