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Machine Capability Analysis (MCA) testing helps improve yields and reduce soldering and missing-component defects by improving dispense accuracy. By running a capability test, the basic settings and functions of the dispenser are checked (clamping, sensors, nozzles, camera, robot, etc.) so that the dispenser is once again operating within the manufacturer’s specifications.

Machine capability for an automated dispenser of adhesives or solder pastes is measured by dispensing dots of material onto a patterned glass test plate and then evaluating it in CeTaQ’s CmController5, which measures the positional accuracy of the dots. The glass plate minimizes the dimensional errors associated with an FR-4 board, for accurate, relevant measurements.

The controller measures the positioning accuracy (x,y) of the dispense gantry, and evaluates deposit accuracy as well as diameter consistency. Measurements are calculated, taking into consideration the impact of placement order, type of head, single dot versus double dot, needle configuration and other parameters.

Provides measurement technology for equipment and process capability analysis for dispensers and other production equipment; the data and measurement results obtained provide the base for stable and controlled dispensing and processing. Special vision algorithms, accurate glass plates and components allow for independent measurement of Cp and Cpk indices on production equipment. All brands and models of SMT printers, dispensers, placement and semiconductor machines are validated. Certification reports validate performance. Does not require a controlled cleanroom environment.

CeTaQ Americas, www.cetaq.com 

‘Plug’n Spray’ spray fluxer is a drop-in replacement for foam, wave and first-generation spray fluxers. Reportedly gives the operator control over critical parameters in the fluxing process to achieve a uniform, well-defined flux deposit and excellent wicking in through-holes. Works with no-clean, alcohol or water-based (VOC-free) flux. Claims to save up to 40% more flux than comparable fluxing systems.

Designed for the specific physical and chemical properties of no-clean flux technology, such as the typical range for surface tension and capillary viscosity of water-based fluxes. Design eliminates over- and under- spraying.

Features an air-driven, high-precision nozzle with an adjustable cone. Has computer-controlled movement, defined spray angle, short distance (30 mm) to the board surface and adjustable pressure setting of the nozzle. Nozzle is mounted on a table that is driven by magnetic force.

The field retrofit system includes a fluxing unit, a control cabinet and an exhaust hood. Generally fits into the position of the fluxer unit of virtually any type of soldering equipment; may also be installed at the input end of a soldering machine.

Cobar Solder Products, www.cobar.com

 

Tyco Electronics has launched an integrated system to address the Unique Identification Program (UID) recently instituted by the Department of Defense (DOD).
 
The system encompasses all aspects of the UID protocol as defined by the DOD and makes the user fully compliant when using specific printing and verification techniques. Includes the five elements necessary for a thorough UID specific implementation: design, printability, validation, verification (grading) and readability.
 
The PrintEasy label design software is capable of designing and creating a valid UID specific 2-D data matrix mark on labels, rating plates, asset tags and wire markers in addition to regular features like graphics, serialization and bar codes.
 
With the appropriate T Series thermal transfer printer, users can print the 2-D Data Matrix codes created with labeling software on a plethora of materials and identification products.
 
Once printed, users apply the label or wire marker to the package, component, equipment or a wire bundle.
 
The system is complemented by a range of validation imagers and verifiers (including software and precision mounted hardware) for validating, error-proofing and grading of the 2-D Data Matrix codes generated specifically for UID applications. The Verifiers also generate comprehensive electronic report cards comprising the various elements and parameters of a 2-D Data Matrix to further optimize the printing and application process. 
 
Tyco Electronics, www.tycoelectronics.com

 

HOUSTON — BP Microsystems, a supplier of device programming systems, announced the release of its BP Win 4.52 and BP Dos 3.89, which offer additional support for the MAX II CPLD family from Altera.

MAX II devices enable designers to use MAX II devices in place of higher-cost or higher-power ASSPs and standard logic devices. The device family is supported on BP Microsystems' full line of device programmers in the 100 TQFP, 144 TQFP and 256 FBGA package styles.  Support for the 324 FBGA package style is scheduled for release this week.

BP Microsystems, www.bpmicro.com

 

The TCJ Series low-profile tantalum solid electrolytic chip capacitor with a conductive polymer electrode meets the lead-free 3 x 260°C reflow requirements. Said to offer lower ESR, safer non-ignition failure mode and better capacitance retention compared to other polymer devices and conventional MnO2 electrode capacitors, all in a low-profile size (1.2 mm height) for use in portable and handheld devices (cellular phones, PDAs and digital cameras).    
 
Suitable for power management systems with operating temperatures up to 125°C. Offer a capacitance range of 10mF to 100mF.
 
AVX Corp., www.avx.com

 

Elkton, MD -- W. L. Gore & Associates, a supplier of cable assemblies, and FCI offer the next generation of high data rate digital interconnect solutions. The data link leverages the advantages of FCI's AirMax VS high-speed connection system with Gore's cable assembly development.  The new configuration uses the AirMax connector concept to provide high-frequency performance without the use of shielding. Target markets include telecommunications, large scale computing,and automatic test equipment.

"We are pleased to bring together FCI's expertise in high speed connector design with Gore's high data rate cable technology to offer a data link that can provide an aggregate bandwidth of 1.0 Terabit per second using only 50 linear millimeters of backplane space," said David Gioconda, global data communications market segment leader for Gore. "This technology is ideal for large scale servers, telecom switches and other data intensive hardware."     

 The cable assembly uses cable with  expanded polytetrafluoroethylene (ePTFE) as the dielectric core. The helically wrapped core ensures constant impedance throughout the length of the cables with stability with temperature cycling or flexing. Their smaller diameter and minimum bend radius reportedly allows more signal lines per area and delivers higher bandwidth performance than comparable cable configurations.
 
Offer low signal loss, low crosstalk, low skew, controlled capacitance and controlled impedance. 
 
The connectors are offered in multiple configurations: 5, 4 and 3 pair per column versions and in a variety of column counts including 10, 8 and 6. 
 
W. L. Gore & Associates, www.gore.com

 

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