SAN JOSE — Worldwide semiconductor manufacturing equipment billings plunged 32% year-over-year in the first quarter, SEMI said this week.

WASHINGTON, DC -- A US House of Representatives committee has submitted a report directing the Missile Defense Agency to consider highly accelerated life testing and highly accelerated stress screening test equipment as means for determining reliability issues, including ones caused by counterfeit electronic components.

BANNOCKBURN, IL — Leading macroeconomic indicators and electronics supply chain indicators point to slow growth in the second quarter, according to IPC's monthly report.

ATLANTA – RF and microwave printed circuit board design and manufacture, 3D IC packaging, and new component packages are among the leading topics at the upcoming PCB West 2013 technical conference and trade show.