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TEDDINGTON, UKNPL’s electronic interconnection group will present eight free one-hour technical webinars over the coming months.

The webinars focus on test methods used to monitor or help evaluate possible failure modes in electronic assemblies. 

The webinar schedule is as follows: Tin Whiskers Evaluation Techniques & Benefits of Conformal Coating, June 22; X-Ray Fluorescence Testing Results with Laboratory & Handheld Systems, Sept. 8; Solderability Assessment – Testing, Aging & Practical Impact on Assembly Yield, Oct. 11; How to Test & Qualify Packages with Scanning Acoustic Microscopy (SAM), Oct. 27; Using Surface Insulation Resistance (SIR) to Qualify Production Processes & Materials, Nov. 8; Cleanliness Assessment Using Solvent Extract & Ionic Extraction to Improve Reliability, Nov. 24; Characterization of Solder Joints, Test Methods & Typical Failure Modes, Jan. 24; Using Mechanical Testing to Diagnose Design, Product & Process Failures, Feb. 21. 

To register, visit http://www.npl.co.uk/ei.   

The group will also host a European technical seminar at its facility in Teddington, UK, on Oct. 29.

TAIPEI -- Foxconn Electronics (Hon Hai) reported fourth-quarter consolidated net profits of NT$21.5 billion ($750.7 million) on revenues of NT$952.1 billion ($33.2 billion).

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BILLINGSTAD, NORWAY -- Top 50 EMS firm Kitron reported first-quarter sales of NOK 429.8 million ($81.5 million), up 4.5% over last year.

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SAN JOSE Flextronics today reported fourth-quarter net sales of $6.9 billion, up 15% year-over-year.

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BANNOCKBURN, ILIPC said North American printed circuit board shipments were up 5.4% year-over-year in March. Orders decreased 9.9% compared to the same month in 2010.

Year to date, circuit board shipments were up 6.9%, while orders were down 7.1%. Sequentially, shipments increased 14.9%, and orders were up 21.9%.

The book-to-bill ratio in March held steady at 0.95. A ratio of more than 1.0 suggests current demand is ahead of supply, which is a positive indicator for sales growth over the next two to three months.

Rigid circuit board shipments were up 5.1%, while orders decreased 10.1% year-over-year.

Year to date, rigid board shipments were up 6.7%, and orders declined 8.5%. Sequentially, shipments increased 14.9%, and orders increased 26%.

The March rigid book-to-bill ratio remained at 0.94.

Flex circuit board shipments for the month were up 9.1%, and orders declined 7.4% compared to March 2010.

Year to date, flex shipments increased 9.3%, while orders were up 9.6%. Sequentially, flex shipments increased 15%, and orders fell 13.2%.

The flex book-to-bill moderated to 1.04.

“North American PCB sales in March were strong, following normal seasonal patterns, and sales of both rigid PCBs and flexible circuits are still ahead of last year,” said IPC president and CEO Denny McGuirk. “Stronger sales than orders is the dynamic keeping the book-to-bill ratio holding slightly below parity, which indicates slowing growth over the next quarter.”

Rigid PCBs represent an estimated 89% of the current industry in North America, says IPC. In March, 83% of total shipments reported were domestically produced. Domestic production accounted for 83% of rigid PCB and 85% of flexible circuit shipments.

 

HAWTHORNE, CA -- OSI Systems today reported fiscal third-quarter electronics manufacturing operating income jumped 138% on a 25% hike in sales.

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