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ST. LOUIS – LaBarge Inc. has been awarded a $2.3 million contract from Northrop Grumman Corp. to continue to produce electronic equipment for the AN/AAQ-24(V) Directional Infrared Countermeasure system.
ESPOO, FINLAND – Nokia Siemens Networks has agreed to acquire certain assets from Nortel.
SAN JOSE – With 155 billion ICs produced, the value of the worldwide IC packaging market was $32.7 billion in 2008, reports Electronic Trend Publications.
BERLIN – The global semiconductor market is expected to decline 21.6% on an annualized basis to $194.8 billion in 2009, according to World Semiconductor Trade Statistics.
ST. PAUL, MN – SUSS MicroTec will distribute 3M’s wafer support system equipment for temporary wafer bonding of ultrathin wafers required for 3-D packaging.
DUBLIN, IRELAND -- US electronics connector sales reached $4.2 billion in 2008, a new research report claims.
Press Releases
- 4FRONT Solutions Invests in Seica’s PILOT V8 NEXT Flying Probe Tester to Enhance Test Capabilities at DeLand, FL Facility; Mike Sementelli Comments
- FRANK Elektronik invests in high-precision SMT line with ASYS machines; Robert Both Comments
- SASinno Americas Opens State-of-the-Art Facility in Washington, Missouri to Support North American Manufacturers; Mike Young Comments
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”