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Japan IC B2B Dropped in September

Published: 25 October 2005
 by Mike Buetow
TOKYO -- Japanese equipment makers posted a 90-day moving average of 119.7 billion yen ($1.04 billion) in orders in September, up 1.8% over revised August levels but down 6.1% from last year.
The book-to-bill ratio was 0.90 for September, down from 1.04 in August, according to the Semiconductor Equipment Association of Japan. The ratio was below the benchmark 1.0 level for the first time in three months. Ratios above 1.0 are seen as a sign of an expansion.

The 90-day average worldwide billings in September was 132.5 billion yen ($1.15 billion), up 17.1% over August and down 9.4% versus last year.

The worldwide semiconductor-equipment book-to-bill ratio was 1.03 in September, down 0.04 points from August, according to research firm VLSI Research Inc.
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