Thermoplastic substrates are suitable for processing using existing PCB fabrication infrastructure, NPL says. The combination of thermal cycling followed by damp heat conditioning has been found to develop high resistance failures in conductive adhesive joints significantly earlier than either damp heat testing or thermal cycling alone, according to the report, Relative Reliability Measurements for Electrically Conductive Adhesive Joints on Subtractive Thermoplastic Substrates.


For a copy of the report, contact ling.zou@npl.co.uk.  

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