MVP is expanding its capabilities to include the application of wire bond to its newly introduced Supra M AOI system.
 
Defects such as wire trace conformity, bent wires, distance to adjacent wires, loop height, straightness tolerance, ball/wedge geometry and contamination can easily be detected with the wire bond configuration.

The system is modeled after the AutoInspector 1820 series, allowing advanced capabilities in a smaller footprint. With full solder joint inspection and measurement capabilities, comes standard with one large-format color digital camera, specialized illumination and a high-precision linear x/y stage in a 960 x 965 mm footprint. The one-camera system allows for a configurable field of view depending on the application. Standard pixel resolution is adjustable from 11 to 15 mm/pixel. The system has CAD-driven, library-based programming.

 Machine Vision Products Inc., machinevisionproducts.com 

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