959T is an alcohol-based, no-clean liquid flux for lead-free wave soldering applications. Is also backward compatible with tin/lead wave soldering operations.
 
Benefits include optimized wetting properties and, according to the company, the shiniest solder joints of any no-clean, solvent-based chemistry.  With a typical solids content of 2.9%, the flux leaves evenly distributed residues. Contains a small percentage of rosin (0.5%), which improves solderability, heat stability and surface insulation resistance. Designed to minimize the incidence of micro-solderballs. 

Can be applied to circuit boards by a spray, foam or dip process. Non-corrosive, halogen-free, Bellcore-compliant and classified ORL0 per J-STD-004.  Flux residues are non-conductive and do not require removal in most applications.

Kester, www.kester.com

 

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