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Textool brand BGA Open Top Test and Burn-In Socket 1.0 mm pitch, Type III is now available.

Using modular, injection-molded bodies and stamp-and-form contacts, this burn-in socket for high-end logic, programmable BGA (PBGA), MCM and system-in-package devices is designed for packages up to 47.5 x 47.5 mm, with matrices of up to 45 x 45 and lead counts to 2025. Is RoHS compliant.

Nest comb design allows full matrix array applications with minimal z-axis warp. By separating the socket nest into dual, interlocking combs, withstands the high contact force loads inherent in high lead count sockets.

Micro-Wiping contact scrubs device leads with each engage and disengage cycle, removing the oxide layer from solder balls, as well as removing contaminants from the contact surface. Contributes to improved contact resistance and reduces the need for cleaning sockets prior to the end of their rated life cycle.

Dual beam contact motion equalizes wear on the contact blades, maximizing mechanical reliability and durability. Facilitates pick-and-place operations by maintaining ball position throughout the actuation cycle. Package shift during loading and unloading is minimal.

3M, www.3M.com

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