Following the launch of Multicore LF318, the Pb-free solder paste has been qualified by leading OEMs, such as Siemens, and CEMs. The halide-free, no-clean, pin-testable paste is said to achieve a consistently high degree of coalescence upon reflow and with high humidity resistance. Reportedly reduces common operational defects such as solder-balling, for reliable, repeatable performance.
 
The product qualification process at Siemens is comprehensive – as were the demands placed upon Multicore LF318 at the company’s Corporate Technology center in Berlin. The paste underwent a series of static tests to measure performance in relation to variables such as corrosion, solderballing and wetting. The product was also successfully exposed to a range of dynamic tests to ascertain the behavior of the paste during printing, evaluating print and slump performance. 
 
Henkel, electronics.henkel.com

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