Hysol QMI536NB non-conductive PTFE-filled paste is for stacked die applications that require extremely low stress and robust mechanical properties. Can be used on all levels of a stacked die, enabling the qualification of a single material. Is said to eliminate provide very low resin bleed and very fast cure. Can be used on solder resist, bare silicon and multiple die passivations. Is lead-free compatible, showing no reliability issues or material deterioration even when processed in higher temperature environments. shows high resistance to delamination and popcorning after multiple exposures to 260°C reflow temperatures.

Henkel, www.electronics.henkel.com 

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