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The Evo 2200 die bonder’s dispensing and bonding systems work in a single module. Throughput is said to reach 5000 cph and a footprint of 116 x 122 cm. Said to process up to 25 different 300mm wafers in a single pass. Has 14 pickup tools and five ejection tools available. Includes heatable bonding tool and the handling range from 250 microns small up to 50 mm large dies. 

Datacon, www.datacon.at  

 

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