News
News
Henkel Releases Hysol QMI708 Die Attach Paste
Published: 07 August 2007
by Staff
Hysol QMI708 die attach paste has been formulated specifically for small die on copper leadframes. Has been developed to attach die 2.5 mm x 2.5 mm and smaller in QFN and SOIC packages. Said to be highly conductive, with low bondjoint resistance. Reportedly dispenses quickly with no tailing; is simple to set up, and allows for a wide dispense window.
Henkel, www.henkel.com/electronics
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