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The Hot-Bar reflow desktop soldering system has pneumatic force adjustment available with a SH500 bonding head. Replaces spring technology and is said to cover a range up to 500N. Force is set by a manual knob; displays set range on a digital screen on the head. Typical joining applications include flex to PCB, wires to PCB, ribbon cables, and SMT components.

Miyachi Unitek, www.muc.miyachi.com