The XPM3 reflow soldering system has the same footprint as its predecessor, the XPM2, but features superior heat transfer, improved cooling, increased uptime, lower cost of ownership, and a new software platform including integrated profiling setup tools.

A forced convection reflow oven, the machine is designed for automated inline processing of SnPb and Pb-free assemblies. It can be operated in air and nitrogen atmospheres. The machine is configurable, with five to 12 heating zones and two to four cooling zones.


One key improvement is the new blowbox, which permits better heat transfer. In the new design, circulation now occurs from side to side, instead of from front to back. This reduces the slots and improves heat transfer by a reported 25%.

The heat exchanger is larger. The primary cell blower speed control enables simultaneous convection level control of all heating and cooling cells, motor speed control via computer interfaced AC variable frequency drive. Individual cell sensing minimizes diagnostic time by detecting and indicating a specific cell motor under speed condition and or cell over-temperature switch activation. Redundant over temperature system provides over-temperature detection. The process tunnel is sealed.

The maximum set-point temperature in air is 350°C, with control accuracy a reported +/-1°C, and cross conveyor uniformity of +/-2˚C. The time to “process ready” status from cold start is less than 30 minutes. The typical nitrogen operating flow rate range is 700 - 2000 cfh, depending on model and conveyor type.

The available heating length is 66 to 160"; the cooling length range is 26 to 48". The overall system dimensions are 139 to 247" (length) by 57" (width).

Cooling is better controlled: Each zone can be set to a temperature and ramped to the user’s specifications. All cooling configurations are designed with active forced convection top and bottom cooling cells with recirculating flow for improved cooling efficiency and capability. The cooling units are simple to access for cleaning, affixed by a drop-down hinged panel. Cooling options include ambient air, nitrogen, or a combination, with an optional integrated chiller.

The patented Flux Flow Control flux evacuation system comes standard.

Conveyor setups include right-to-left; belt-only; edge-rail only; and combination edge-rail and belt conveyor in widths up to 22". The speed range is 10-75"/min.

A dual lane edge-rail conveyor package is available that simultaneously transports products up to 8.5" maximum width per lane.

The motor and hand crank are new as well.

The XPM3 is compliant with SMEMA-9851, CE, EU Directive, UL 499 and others. Heater design meets CE Compliance Hi-Pot test requirements.

Separately available is the 6745 low-volume, high-mix selective soldering machine. The machine holds the Selectwave solder bath and has a two flux tank capacity. The machine feature a pin-activated release, and an adjustable gripper, which accommodates panel sizes of 4 x 6" min. to 16 x 16" max. A pallet gripper has alignment pins to facilitate use without changing the machine width or when preexisting wave pallets are available.

The EasyTeach software imports profiles and requires no data be inputted; instead, users can simply scan the board. A solder program may be copied to multiple boards via a mouse click. The tool shows flux and solder and reference lines simultaneously. The program can then be saved and the software calculates the optimum path for fluxing and soldering

Available from Vitronics Soltec; vitronics-soltec.com.

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