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SCOTTSDALE, AZ – The PC microprocessor market is heading for an inflection point in late 2008 or early 2009, when, for the first time, the number of microprocessors shipping for notebook PCs will exceed those shipping for desktop PCs, reports In-Stat.

SINGAPORE -- Flextronics became a little more vertical, completing its acquisition of the FRIWO Mobile Power business unit of CEAG AG. FMP makes power supplies and chargers for mobile phones, and has 18,000 employees and 700,000 sq. ft. of manufacturing capacity in China.

SMYRNA, GA – UP Media Group, parent company of Circuits Assembly and Printed Circuit Design & Fab, will broadcast "Optimize System Performance with FPGA/PCB Co-Design," a 45-minute free Webinar, on June 3, at 2 PM EDT.

Bob Potock, director of FPGA marketing for Mentor Graphics, Systems Design Division, will discuss how new FPGA/PCB concurrent design processes and tools can significantly improve system performance and product costs, as well as designer productivity. Attendees will learn the elements of an effective FPGA on-board strategy, how to boost productivity and PCB quality, and be introduced to specific implementation options.

This event is the third in a series of Webinars addressing how to efficiently design today’s increasingly complex PCBs in the competitive electronics industry.

To register, visit http://www.pcbshows.com/webinars.

TORONTO – SMTC Corp. reported March quarter revenue of $55.1 million and net income of $400,000 For its first quarter ended March 30, sales were down 20.3% and profits were off 86% versus last year. However, net income for the first quarter of 2007 included a $1.8 million tax recovery and related interest.

JASPER, IN – Kimball International today reported a fiscal third-quarter net loss from continuing operations of $900,000 on net sales of $332.1 million. For the quarter ended March 31, sales were up 7%, but earnings fell 120%.

SAN JOSE – University of California-Berkeley professor Dr. Luke P. Lee will unveil the future of medical innovations through functional BioPOETIC (Biologically-inspired Photonics-Optofluidics-Electronics Technology-based IC) devices and packaging when he keynotes the MEMS Packaging Symposium this month.

The symposium is sponsored by the MicroElectronics Packaging and Test Engineering Council (Meptec), which announced the final program is in place. MEMS Market Evolution: From Technology Push to Market Pull takes place May 22, in San Jose.

Other presentations include sessions on consumer and automotive applications:

Karen Lightman, managing director, MEMS Industry Group, on findings and recommendations from METRIC 2008, the annual meeting for members of MEMS Industry Group.
Moshe Gat, R&D section manager, Wireless Semiconductor Division, Avago Technologies, Size Reduction and Integration of RF filters in Cellular Phones.
Ken Yang, Ph.D., advanced MEMS development manager, Analog Devices, Three-Axis Motion Sensor Development and Production for Consumer Electronics Market.
Aaron Partridge, chief science officer, SiTime, MEMS Timing – More Function in a Smaller Package.
Janusz Bryzek, LV Sensors, Inc. / Joseph R. Mallon, Jr., Exept/Stanford University, Green Killer Application: Wireless Tire Pressure Monitoring.
Jonathan Rheaume, Research Specialist, UC Berkeley, Micro-Printed Solid State Electrochemical Sensor for Monitoring Lean Direct Injection Engines.
Venkataraman Chandrasekaran, senior design engineer, Sensata Technologies, Sensors at Sensata: Recent and Emerging Applications in Powertrain and Safety Systems.