BRUSSELS – After eight years of study, the European Commission has cleared Tetrabromobisphenol A for use without restriction in the EU. This marks the end of an official risk assessment of TBBPA, a brominated flame retardant used in more than 70% of PCBs.
The EU Risk Assessment evaluated TBBPA for potential risks to human health and the environment. The commission concluded no risk was identified for the reactive use of TBBPA such as in epoxy resins used in printed circuit boards.
WASHINGTON — Retail sales of consumer electronics and appliances rose 3% year-over-year in the May quarter, up from 1.5%
sequentially, according to the US Census Bureau.
Furthermore, North American TV shipments rose 4% during the first quarter, says research firm DisplaySearch, with LCD shipments leading the way, rising 110%.
WASHINGTON -- The chief executive of Cirrus Electronics has been sentenced to 35 months in jail after pleading guilty to illegally exporting electronics components used in missiles to India.
In return for pleading to exporting the
components to Indian government entities, guilty, Parthasarathy
Sudarshan will also pay a $60,000 fine. The components are used in ballistic missile guidance systems.
WYLIE, TX -- Global Innovation, a maker of bare boards and assemblies, reported April quarter revenues of $8.3 million, up 9.2% year-over-year. Net income for the company's fiscal third quarter was flat at $186,594.
Gross profit rose 3.1% to $1.7 million, while gross margins dropped 2.7 points to 19.1%.
KUALA LUMPUR – Unisem and its subsidiary Unisem-Advanpack Technologies have entered into an agreement with FlipChip International to license FCI’s wafer bumping and wafer level packaging technologies.
UAT will license FCI’s core technologies, including Spheron, and FCI will become a shareholder of UAT.
“This new partnership with FCI will enable Unisem to offer additional cutting-edge wafer bumping and wafer level packaging alternatives to our customers,” said S.C. Lau, general manager of UAT. “FCI is providing all necessary documentation, training and engineering support for a fast ramp of its wafer bumping and wafer-level packaging technologies, which will be quickly integrated into our existing full production environment.”
FRANKFURT -- May semiconductor sales in Germany were down 19% year-on-year, the Electronics Industry Association (ZVEI) said.
In April and March, sales were down 16% year-on-year, respectively, ZVEI said.
The preliminary book-to-bill ratio in May was 1.01, up from 0.94 in April.
The ratio is calculated by the value of orders divided by the value of shipments. A ratio of 1.01 means that for every $100 worth of semiconductors shipped, $101 worth of semiconductors were ordered.
A ratio above 1.0 is considered a sign of expansion.