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IPC (Northbrook, IL) has announced the collection of free events planned for its co-located IPC SMEMA Council's APEX/IPC Printed Circuits Expo/IPC Designers Summit exhibition and conference, being held Feb. 24-26, 2004, at the Anaheim Convention Center, in Anaheim, CA.

In addition to the complimentary keynote addresses of Solectron president and chief executive officer Michael Cannon, industry forecaster Walt Custer and the multi-talented Bill Nye-The Science Guy, the trade show will feature eight free forums throughout the exhibition and conference. The schedule includes:

1) Beyond Lead Free-WEEE/ROHS on Feb. 24
Chair: Fern Abrams, IPC
This panel discussion will provide insights into what leading companies are doing to prepare for the July 2006 lead-free compliance deadlines along with the latest developments in legislation, exemptions and definitions of lead free under Waste Electrical and Electronic Equipment (WEEE) and Restriction on Hazardous Substances (RoHS). Additionally, the panel of experts will examine the ripple effects of this legislation on laws and regulations in the U.S. and abroad.

2) North America or Asia: Where is the Best Place for Your Manufacturing? on Feb. 25
Chair: Lisa Hamburg, Circuits Assembly magazine
The relative complexity, quantity required, circuit density, level of customization needed and delivery time frame are just a few of the issues that help determine the supply source. This panel discussion will discuss and debate the various pros and cons of overseas sources.

3) IPC PCQR2 Database-Globally Accepted de facto Standard for Comparing Process Capability, Quality and Relative Reliability of PCB Suppliers on Feb. 24
Chair: David Wolf, CAT, Inc.
The IPC D-36 Subcommittee has developed an industry standard, IPC-9151A, for process capability test panel designs and the PCQR2 database detailing the capabilities of printed circuit board (PCB) suppliers. The database provides quantitative data that allows subscribers to statistically benchmark board suppliers' capabilities; perform intelligent sourcing; select new suppliers; ensure design for manufacturability; and establish realistic design rules. The seminar will include in-depth discussions on the test panel designs, analysis reports and the capabilities of the PCB supply chain documented in the database.

4) Domestic PCB Technology Innovations at the U.S. Naval Surface Warfare Center, Crane Division on Feb. 26
Chair: Bill Payne, EG&G Crane Operations
The Emerging Critical Interconnect Technology (ECIT) program was created to co-opt military, academic and industrial extension for the purpose of facilitating North American research and development consistent with IPC's technology roadmap. This presentation will provide insight into ongoing ECIT projects, their goals, status, the participants and potential delivery schedules.

5) NEMI Defective Parts per Million Opportunities (DPMO) Project Forum on Feb. 25
Chairs: Tim Kruse, Plexus NPI Plus, and David Mendez, Solectron Texas LP
The NEMI DPMO project team is nearing completion of an investigation into package-level DPMO rates throughout the electronics assembly industry. Such DPMO data can be used to quantify the expected fault spectrum on a particular PCB assembly, enabling manufacturers to more accurately assess the cost of assembly, test, repair and scrap and also estimate the shipped product quality level of a product. Participants in the NEMI DPMO Project Team will present findings from the study, share the lessons learned and discuss the vision for follow-up on DPMO efforts in the industry.

6) Will the Real Immersion Silver Please Stand Up? on Feb. 24
Chairs: Kim Hyland and Dave Mendez, Solectron
As consumers demand more cutting-edge electronic devices, as original equipment manufacturers (OEMs) design higher functioning boards and as chemical companies make new PCB surface finishes, fabricators and assemblers need to endure the fast progression of all these changes. In this session, representatives from fabrication, assembly, OEM and chemical supply companies will answer all questions and concerns relating to the implementation of immersion silver.

7) Reactivation of IPC's OEM Council on Feb. 25
Chair: Daryl Sato, Intel Corp.
IPC is reactivating its OEM Council, which has made significant contributions to efficiency in the supply chain through development and release of standardized vendor surveys. The council's mission is to develop and use a methodology for PCB technology and assessment and advancement, evaluate PCB supplier process capabilities, identify technology gaps and monitor R&D advancements and PCB design changes to ensure gap closure. The panel will discuss their working group efforts and solicit feedback on ways to integrate and expand such collaborative projects through the OEM Council.

8) International Technology Interchange-Total Packaging Solution Roadmap on Feb. 24
Chair: Dieter Bergman, IPC
This forum will discuss global industry needs and how international organizations are involved in developing common ways of understanding future development and improving the international supply chain. The panelists will cover various topics, ranging from the definition of Jisso to the hierarchy of electronic packaging to optoelectronics and a global outlook on lead and halogen free.

For more information about these events, visit http://shows.ipc.org or contact Joe Dudeck, IPC communications manager, JoeDudeck@ipc.org.

www.ipc.org

LPKF Laser & Electronics (Wilsonville, OR) has announced the release of the low cost SL740 surface-mount technology stencil laser cutter. The system is designed for low- and medium-volume stencil production, cutting up to 3,000 apertures per hour.

The cutter uses the same proprietary high power infrared laser source compliant with laser safety class 1 as found in LPKF's higher-end models. The entry-level system provides high accuracy and reliability, making it ideal for start-up stencil businesses or a backup system for established shops. It offers a cutting area of 29 x 29 in. and accommodates all common stencils, including stencils for quick release frames. Mounting fixtures are provided for both bare sheets and framed stencils.

"With the introduction of the SL740, we are excited to better address the entry-level market space, while maintaining the signature reliability and accuracy of LPKF's products," said Stephan Schmidt, vice president of LPKF North America.

www.lpkfusa.com

Reptron Electronics Inc. (Tampa, FL), an electronics manufacturing services company, reported that its Second Amended Plan of Reorganization under Chapter 11 of the Bankruptcy Code was confirmed by the U.S. Bankruptcy Court on Jan. 14, 2004. Reptron anticipates the effective date of this confirmation to occur on Jan. 26, 2004, which is about 90 days from the original filing date.

Under the confirmed plan of reorganization, the company's unsecured class of creditors that includes its existing convertible notes will receive new notes with a total principal amount of $30 million. The existing notes, along with all accrued and unpaid interest, will be cancelled. The unsecured class of creditors will also receive 95% of the common shares of the reorganized company. Existing common shareholders will receive the remaining 5% of the common shares of the reorganized company.

"The restructuring of our convertible notes is a key component in our strategic plan, which we believe positions the company to take advantage of future growth opportunities," said Paul J. Plante, Reptron's president and chief operating officer. "Once the restructuring is completed, Reptron will have reduced its debt load by over $70 million over the past 12 months. We are extremely pleased to have completed this restructuring in such a short time frame."

www.reptron.com

IPC (Northbrook, IL) and JEDEC, the Solid State Technology Association, have announced plans to further their efforts in preparing electronics manufacturers for the inevitable European ban on lead by co-sponsoring three international conferences on Lead-Free Electronic Components and Assemblies in the U.S., Europe and Asia in 2004.

Ever since the European Union agreed upon the Restriction of Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive, in which all affected electrical equipment sold in Europe after July 1, 2006, must be free of lead, IPC and JEDEC have taken an active role in keeping the industry informed of changing requirements and encouraging the voluntary elimination of lead. In their second year of jointly producing domestic and international conferences on lead-free electronics, IPC and JEDEC will host lead-free conferences on March 17-19, 2004, in San Jose, CA; in August 2004 in Singapore and Oct. 20-22, 2004, in Frankfurt, Germany.

Each international conference provides tutorials focusing on subjects such as manufacturing with lead-free, halogen-free and conductive adhesive materials, as well as various workshops that introduce lead-free solders and present selection criteria for lead-free compositions.

The associations will also select industry experts to present a two-day technical conference covering crucial lead-free topics. Presently, conference chairs Jean Hebeisen and David Bergman of IPC and John Kelly and Donna McEntire of JEDEC are seeking papers and presentations in the following areas:

Policy: European lead ban status
Electronics Manufacturing Services (EMS) Industry: On the front line of the change
Component issues (passives and actives)
Design issues
Environmental health and safety effects and alternatives
Printed circuit board (PCB) issues
Original equipment manufacturer (OEM)/Consumer demands/voluntary elimination dates
Recycling options
Substitutions: New commercially available alloys/conductive adhesives/ease of replacement
Cost issues
Reliability evaluations (such as temperature cycling data, tin whiskers)
Roadblocks to implementation
Finishes issues: Organic solder protectants, immersion tin, silver, electroless nickel and palladium
Lead-free and other product sectors

For more information on the conferences or submitting abstracts, visit: www.jedec.org or www.ipc.org.

The monthly order index compiled by the Electronic Components, Assemblies & Materials Association (ECA, Arlington, VA) took its annual December dip, but the outlook remains positive for 2004.

"Based on previous years, we expected a December dip," said Bob Willis, ECA president. "The good news is that the December dollar value is up by more than 20% over 2002, and the 12-month moving average ended on an upward note. Our members believe that 2004 might be the first year of sustained growth since 2000."

Electronic components are the building blocks of most consumer goods and technology hardware, so the industry normally reflects the movement of the economy as a whole. This year, the outlook is good. Nariman Behravesh, chief economist for Global Insight, predicts that economic growth in 2004 will be the strongest since the bursting of the high-tech bubble in 2000, with the U.S. and Asian countries outside of Japan enjoying the fastest growth.

Behravesh said, "The beleaguered manufacturing sector will finally enjoy a year of strong, uninterrupted growth - barring any unforeseen shocks."

According to Willis, the ECA has scheduled a full slate of events and marketing opportunities that will help its members make the best of the industry's rebound.

"There is a lot of justifiable optimism, but companies need the resources to manage the intricacies of demand, raw materials, supply flow, distribution, inventory and other interrelated issues," said Willis. "We had prosperity a few years ago, but it went bust. We want our members to have access to the information and opportunities that will allow them to take advantage of the good and mitigate the bad."

www.ec-central.org

Professor Deborah Nightingale, PhD., of the Massachusetts Institute of Technology (MIT) Lean Aerospace Initiative (LAI) will present a keynote presentation, "Transforming the Lean Enterprise Value Stream," on May 6, 2004, as part of the NEPCON East/Electro and Assembly East event. The co-located manufacturing shows will take place May 5-6 at the Hynes Convention Center in Boston, MA.

The conference program will begin one day earlier on May 4. Combined, the three shows will provide Northeast manufacturers with a single source for cutting-edge manufacturing solutions at the board, component and final product assembly levels. In addition, attendees can see even more new products with the concurrent running of The Vision East Show featuring automated machine vision solutions.

"Lean Manufacturing is a very hot topic," said Kelvin Marsden-Kish, vice president of the NEPCON/Assembly family of events, produced by Reed Exhibitions. "To have a world-class educator such as MIT's Professor Nightingale share their knowledge will be very valuable for NEPCON East/Electro and Assembly East attendees."

In her address, Professor Nightingale will share the successes that the MIT LAI has experienced with its implementations of Lean. The presentation will focus on the need for contemporary networked enterprises transforming the entire value stream, including suppliers and partners. Dr. Nightingale will explain how applying lean principles to all life cycle, enabling and leadership processes will be required to achieve value for the total enterprise.

Nightingale is a Professor of Practice in the Department of Aeronautics and Astronautics and the Engineering Systems Division. She serves as the MIT lead on the Lean Enterprise research and product development team within the LAI. Prior to joining MIT in 1977 she worked for AlliedSignal Aerospace for 17 years, serving in executive leadership positions across the entire enterprises.

http://lean.mit.edu

www.nepconeast.com

www.assemblyeast.com