OSAKA, JAPAN — Copper and nickel are "essential" elements in forming a stable intermetallic compound layer in lead-free soldering, a joint industry-academia study has found.

BANNOCKBURN, IL — North American printed circuit board fabricators reported a 5.6% year-over-year drop in orders in November on typical seasonality.

MANASSAS, VA -- Starting in January, Zestron will sponsor a free, 10-part Webinar series on cleaning in 2012.

OSAKA, JAPAN — A new guide from Nihon Superior on “Reliability of Lead-Free Solder in Thermal Cycling” is the first in a series on lead-free solder selection.