Circuits Assembly Online Magazine - 2005 Articles

2005 articles

If each component can be verified, then the finished product falls into place.

Area arrays face higher thermal stress, leading to topside ball delamination. A review of the literature, and a novel solution.

This study established the ideal sensitivity setting for catching BGA voids.

This technique permits reuse of test data and cuts costs by eliminating ICT and functional test.

Regardless of flux, silver-containing alloys can achieve acceptable wetting at high temperatures.

Most machines pass the test, but some key changes are ahead.

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NOVEMBER ISSUE

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Press Releases

Koh Young Honored by Foxconn with 2024 Digital Ecosystem Partner Award
SIA Applauds Finalization of CHIPS Investments for Intel Manufacturing Projects
Spectrum Advanced Manufacturing Technologies Named Manufacturing Partner for D-Orbit USA
Absolute EMS Enters Strategic Partnership with PTEC Solutions to Enhance End-to-End Electronics Manufacturing Capabilities

2005 Articles

2005 articles

RoHS and the Supply Chain

If each component can be verified, then the finished product falls into place.

Pb-Free Flip Chip and CSP Inspection

Area arrays face higher thermal stress, leading to topside ball delamination. A review of the literature, and a novel solution.

Reducing BGA Defects with AXI Inspection

This study established the ideal sensitivity setting for catching BGA voids.

The Basics of Boundary Scan

This technique permits reuse of test data and cuts costs by eliminating ICT and functional test.

Wetting Characteristics of Pb-Free Alloys of Interest

Regardless of flux, silver-containing alloys can achieve acceptable wetting at high temperatures.

Can Existing Tools Survive Pb-Free Soldering?

Most machines pass the test, but some key changes are ahead.

Press Releases

2005 Articles

2005 articles

RoHS and the Supply Chain

If each component can be verified, then the finished product falls into place.

Pb-Free Flip Chip and CSP Inspection

Area arrays face higher thermal stress, leading to topside ball delamination. A review of the literature, and a novel solution.

Reducing BGA Defects with AXI Inspection

This study established the ideal sensitivity setting for catching BGA voids.

The Basics of Boundary Scan

This technique permits reuse of test data and cuts costs by eliminating ICT and functional test.

Wetting Characteristics of Pb-Free Alloys of Interest

Regardless of flux, silver-containing alloys can achieve acceptable wetting at high temperatures.

Can Existing Tools Survive Pb-Free Soldering?

Most machines pass the test, but some key changes are ahead.

Press Releases

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