• Digital Edition
  

FEATURES

• Thermal Transfer
  Understanding IPC-9850
  Heat dissipation, accomplished by thermal management techniques, is necessary to keep device temperatures within safe operating limits. Effective thermal management prevents damage to temperature-sensitive internal components, as well as premature shutdown and even system failure. It also can improve performance by enabling assemblies to run at higher speeds.
  By Chris Dobrowolski
  

• Cover Story
  Electronics as a Solution for Sustainability
  Instead of eliminating potential pollutants from electronics, perhaps it’s time the electronics industry saw itself as a solution for climate change.
  By Markus Stutz and Robert C. Pfahl, Jr.

• Board Repair
  Optimizing Outsourced Medical Equipment Repair Depot Support
  Medical repair depot has a level of complexity far greater than that of consumer products. For OEMs, the repair depot can be a source of hidden cost or a source of added revenue. The defining factor is the efficiency of the reverse logistics strategy.
  By Scott Mauldin

• Materials Reporting
  How REACH Impacts Electronics Components Use
  The latest EU directive requirements are massive and involve manufacturers and importers of chemicals, compounds and articles. Here are seven basic points about REACH that every manufacturer of electronics assemblies selling product in Europe must understand.
  By Steve Schultz

FIRST PERSON

• Caveat Lector
  Limit the limits.
  Mike Buetow

MONEY MATTERS

• Focus on Business
  New school of marketing thought.
  Susan Mucha

• Global Sourcing
  The bust of lust.
  Charlie Barnhart

TECH TALK

• On the Forefront
  Culture shock.
  E. Jan Vardaman
  
  
• Screen Printing
  Closed-loop process control.
  Dr. Rita Mohanty
  

• Better Manufacturing
  'Co-op'-eration.
  Peter Grundy
  

• Tech Tips
  DoE rules of engagement.
  American Competitiveness Institute
  

• Selective Soldering
  Nozzle performance factors.
  Ursula Marquez de Tino
  

• The Defects Database
  Conformal coating cracking.
  Dr. Davide Di Maio
  

• Wave Soldering Troubleshooting
  Felling bridges.
  Paul Lotosky
  

• Process Doctor
  C3, under the microscope.
  Terry Munson

• Getting Lean
  Plant layout and other lessons of Lean.
  Chris Munroe
  

• Materials World
  Dr. Renzhe Zhao
  

• Equipment Advances
  Siemens' Multistar placement head.

• Technical Abstracts

DEPARTMENTS

Industry News
Market Watch
Product Spotlight
Ad Index
Assembly Insider

On the Cover: iNemi's latest roadmap takes aim at product sustainability.

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