caLogo

Circuits Assembly October 2009 cover

FEATURES

FIRST PERSON

TECH TALK

  • Screen Printing
    Combining clamping and snugging in a single board handling method.
    Clive Ashmore
  • Reflow Soldering
    Larger pads and better PCB layout will reduce strain.
    Ursula Marquez de Tino, Ph.D. and Brian Roggeman
  • Wave Soldering Troubleshooting
    If solder isn’t reaching the components, check these areas.
    Paul Lotosky
  • The Defects Database
    What look like open BGA joints might be tricks of the light.
    Dr. Davide Di Maio
  • Process Doctor
    Chemistry cleaning trials should be conducted prior to equipment selection.
    Harald Wack, Ph.D.
  • Tech Tips
    Special software permits factory floor adjustments, potentially saving capital investments.
    ACI Technologies Inc.
  • Test and Inspection
    Five ICT tools for limited access testing.
    Andrew Tek
  • Solar Technologies
    The two primary ways need more repeatable accuracy.
    Darren Brown
  • Technical Abstracts
    In case you missed it.

 

DEPARTMENTS

Off the Shelf

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account