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FEATURES

• Cover Story
  Preventing MLCC Failures
  Mechanical anomalies can cause electrical failure in MLCCs. Many defects - including cracks caused by panel separation - can be uncovered by first performing acoustic imaging on unassembled parts.
  By Tom Adams
  

• Reflow Profiling
  Oven Adjustment Effects on a Solder Reflow Profile
  A recipe that works for one board won't necessarily work for another board if the weight or design is significantly different. This study found that of the three oven adjustments, zone set points have the biggest effect on peak temperature and TAL.
  By Fred Dimock
  

• Cover Story
  More than Just a Look
  SPI market leader Koh Young is shrugging off the recession and taking Europe head on. Circuits Assembly visits the OEM to learn why now, and to get an in-depth look at its new 3-D AOI machine.
  By Mike Buetow
  

FIRST PERSON

• Caveat Lector
  The estimable legacy of iNEMI CEO Jim McElroy.
  Mike Buetow

TECH TALK

• On the Forefront
  The backend semiconductor industry is feeling the recovery's bumps.
  E. Jan Vardaman
• Screen Printing
  Understencil cleaning's little devil.
  Clive Ashmore
• Better Manufacturing
  The need for speed.
  Jeff Knight
• Wave Soldering
  Optimizing the wave process is no simple feat.
  Ursula Marquez de Tino
• Tech Tips
  Changing the finish for BGA boards could mean no more "HASLs."
  ACI Technologies Inc.
• Wave Soldering Troubleshooting
  No stick solder.
  Paul Lotosky
• Getting Lean
  How to measure customer satisfaction.
  Tony Bellitto
• The Defects Database
  Thin hole plating could be susceptible to lead damage.
  Dr. Davide Di Maio

DEPARTMENTS

Industry News
Market Watch
Product Spotlight
Ad Index
Assembly Insider

On the Cover:An acoustic image of an MLCC containing a single void.

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