2015 Magazine Archives

• View the Digital Edition

FEATURES

LINE BALANCING
A History of Placement Programming and Optimization
A look under the hood at SMT optimization algorithm strategies reveals where it has all gone wrong and suggests the possibility of a completely fresh approach.
by Michael Ford

REFLOW SOLDERING
Soldering With Vacuum Profiles
Soldering with targeted use of vacuum can contribute to a considerable reduction of the number of voids and void content.
by Helmut Oettl

TALKING HEADS
‘The New Rules Are Better Rules’
Soldering with targeted use of vacuum can contribute to a considerable reduction of the number of voids and void content.
by Helmut Oettl

FIRST PERSON

• CAVEAT LECTOR
  Foxconn’s India rush.
  Mike Buetow

MONEY MATTERS

• ROI
  Is there more to Moore’s Law?
  Peter Bigelow
  

• FOCUS ON BUSINESS
  The tradeoffs of Mexico.
  Susan Mucha
  
  

TECH TALK

• SCREEN PRINTING
  The five particle rule.
  Clive Ashmore
• TECH TIPS
  In search of the perfect solder paste.
  Tim O’Neill and Karl Seelig
• TEST AND INSPECTION
  Why become a test engineer?
  Jun Balangue
• GETTING LEAN
  Waste on the SMT line.
  Michael Ford

• Prev
• Next