caLogo

News

ST. LOUIS -- EMS provider LaBarge Inc. reported fiscal first-quarter net earnings rose 5% sequentially on a 19% jump in net sales.

For the period ended Sept. 30, net profits were $2.5 million on sales of $59.2 million.

Gross margin was 19.2%, up from 18% in the fourth quarter but down from 21.4% last year.

Net cash from operations was $5.1 million, up from $1.04 million in the fourth quarter and down from $10.4 million a year ago.

Bookings were extremely strong, exceeding $100 million, a record for the company, on demand from the defense, natural resources and industrial sectors. Backlogs at Sept. 30 were $245.5 million, also a record and up 19% from July 1 and 16% from last year.

Chief executive and president Craig LaBarge said, “LaBarge’s long-term business outlook remains very positive based on the strength of our current backlog and a healthy pipeline of new business opportunities. We expect second-quarter sales and earnings will compare favorably to this year’s first-quarter results. Further, we expect our improving mix of business to drive further gross margin improvement in the second half of the fiscal year. We expect fiscal 2008 to be another record year.

MINNEAPOLIS -- Electronics manufacturing services firm Nortech Systems reported net sales of $29.6 million for the third quarter ended Sept. 30, up 17 % over the same period in 2006.

Operating income was $1 million, up 58%, and net income was $420,506, up 38%.


DURHAM, NC – The SMTA’s 3D/SiP/Advanced Packaging Symposium will be held Apr. 29-30 at the Washington Duke Inn & Golf Club, Durham, NC.
 
The symposium will provide research in the field of advanced packaging with particular attention to materials, manufacturing, assembly and Package/PWB reliability in a Pb-free environment.
 
Two-hundred to 300-words abstracts are being requested in the following areas: system in package; multi-chip packaging; materials/finishes/solder alloys; reliability; package on package; enabling technologies; die stacking/3D assembly; wafer-level packaging; bumping/flip chip on board; handheld electronics/miniaturization; 3D wafer level integration; 3D wafer level packaging; die/package/system co-design; modeling and simulation; drop/shock/bend performance, and infrastructure.
 
Send abstracts in Word to Melissa Serres, Melissa@smta.org.
 
Please include name, company, mailing address, telephone number, fax, e-mail, and presentation title.
 
The deadline for abstracts is Nov. 30.
 
Speakers will be required to submit presentation slides if selected.

Page 3974 of 5009

Don't have an account yet? Register Now!

Sign in to your account