News
SPRINGFIELD, MA -- In the second largest EMS acquisition of the day, Nu Visions Manufacturing and San Francisco-based private equity firm Golden Gate Capital bought Veritek Manufacturing Services for an undisclosed amount.
San Marcos, CA-based Veritek has plants in San Jose and Longmont, CO.
SPOKANE VALLEY, WA – ACE Production Technologies has acquired all Drop-Jet Spray Head technology and its related products from Castle Controls & Automation.
ACE will offer the flux head as an option on its selective soldering products, and will announce standalone and inline fluxing products in the coming months.
No other terms of the agreement were disclosed.
ACE will offer the flux head as an option on its selective soldering products, and will announce standalone and inline fluxing products in the coming months.
No other terms of the agreement were disclosed.
COLORADO SPRINGS, CO – A top stencil manufacturer has devised a process for eliminating wave soldering.
A recent paper authored by Photo Stencil vice president of technology Dr. Bill Coleman outlines a procedure called intrusive reflow, said to improve Pb-free material printing.
One objective of the study was to maximize the amount of solder paste printed into the through-hole. With proper squeegee speed and squeegee angle, 100% hole fill was achieved for 0.063"-thick boards and 85% hole fill for 0.093" -thick boards with a 0.006"-thick stencil. This reportedly resulted in good top and bottom fillets and continuous solder fill around the pins with a 0.006"-thick stencil for 0.063" and 0.093"-thick boards for resistors, DIPs and four-row header arrays.
X-rays of paste hole fill and cross-sections of through-hole pins after reflow are shown in the paper. To download the paper, visit www.photostencil.com/techpapers.htm.
A recent paper authored by Photo Stencil vice president of technology Dr. Bill Coleman outlines a procedure called intrusive reflow, said to improve Pb-free material printing.
One objective of the study was to maximize the amount of solder paste printed into the through-hole. With proper squeegee speed and squeegee angle, 100% hole fill was achieved for 0.063"-thick boards and 85% hole fill for 0.093" -thick boards with a 0.006"-thick stencil. This reportedly resulted in good top and bottom fillets and continuous solder fill around the pins with a 0.006"-thick stencil for 0.063" and 0.093"-thick boards for resistors, DIPs and four-row header arrays.
X-rays of paste hole fill and cross-sections of through-hole pins after reflow are shown in the paper. To download the paper, visit www.photostencil.com/techpapers.htm.
Press Releases
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Chihuahua Expo & Tech Forum
- PDR Appoints Bob Pearson of PAC-Global Texas to Central Texas Region
- Avalon Technologies Expands PCB Assembly And Design Services To Meet Growing Demand In The Electronics Industry
- KYZEN to Promote Pair of Stencil Cleaning Chemistries at SMTA Chihuahua Expo & Tech Forum