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PHOENIX – EMS provider Suntron Corp. announced today that its majority shareholder, Thayer-Blum Funding, intends to take the company private, subject to completion of financing. The deal is expected to close in December. Read more ...
ANGLETON, TXBenchmark Electronics lowered its third-quarter guidance by $50 million to $100 million due to slower than anticipated product and program transitions, and softer demand.

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SAN JOSE – The MicroElectronics Packaging and Test Engineering Council announced its technical symposium Substrates: The Foundation of Semiconductor Packaging, to be held in San Jose Nov. 8.

The objective of this symposium is to identify technology requirements for the next generation of substrate technology, highlighting required innovations that will further enable IC component integration, and electronic system functionality.

The program is segmented into the following areas: Substrate Manufacturing and 1st Level Interconnect Technology; Design and Simulation: Silicon, Substrate, System; 2nd Level Interconnect and Reliability, and Emerging Substrate Technologies.

For more information, visit www.meptec.org.

 

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