PHOENIX – EMS provider Suntron Corp. announced
today that its majority shareholder, Thayer-Blum Funding, intends to take the
company private, subject to completion of financing. The deal is expected to
close in December.
ANGLETON, TX – Benchmark Electronics lowered
its third-quarter guidance by $50 million to $100 million due to slower than
anticipated product and program transitions, and softer demand.
SAN JOSE – The MicroElectronics
Packaging and Test Engineering Council announced its technical symposium
Substrates: The Foundation of Semiconductor Packaging, to be held in San Jose
Nov. 8.
The objective of this symposium is to
identify technology requirements for the next generation of substrate
technology, highlighting required innovations that will further enable IC
component integration, and electronic system functionality.
The program is segmented into the
following areas: Substrate Manufacturing and 1st Level Interconnect Technology;
Design and Simulation: Silicon, Substrate, System; 2nd Level Interconnect and
Reliability, and Emerging Substrate Technologies.