News
EL PASO, TX – Susan Mucha, president of EMS consulting firm Powell-Mucha Consulting, and the SMTA will present on June 6 the second part in their Webinar series on Building a Competitive EMS Brand.
The Webinar, EMS Marketing Basics, takes place from 1-2:30 p.m. EST. This online presentation will cover key considerations in differentiating a brand, developing a robust EMS marketing toolbox, and linking promotion effort to the outsourcing decision cycle.
For information and registration visit:
http://www.smta.org/education/presentations/presentations.cfm#competitive.
The cost is $75 for SMTA members and $150 for nonmembers.
To obtain a copy of the first Webinar in the series, Understanding Competitive Advantage in EMS Services, contact Mucha at smucha@powell-muchaconsulting.com.
The Webinar, EMS Marketing Basics, takes place from 1-2:30 p.m. EST. This online presentation will cover key considerations in differentiating a brand, developing a robust EMS marketing toolbox, and linking promotion effort to the outsourcing decision cycle.
For information and registration visit:
http://www.smta.org/education/presentations/presentations.cfm#competitive.
The cost is $75 for SMTA members and $150 for nonmembers.
To obtain a copy of the first Webinar in the series, Understanding Competitive Advantage in EMS Services, contact Mucha at smucha@powell-muchaconsulting.com.
EL SEGUNDO, CA – Semiconductor shipments in China will rise to $51.7 billion in 2007, up 20% from 2006, iSuppli Corp. predicted today. Shipments to China rose 15% in 2006.
ENDICOTT, NY – Endicott Interconnect Technologies has received $49 million in followup orders from the U.S. Department of Defense for electronics packaging and substrates for high-end computing.
The program includes $5 million for electronics packaging R&D, EI said.
The contract is the first of a three-phased, five-year program that uses EI as a DoD research arm for exploring high-speed electronics technologies. Phase one includes system development and preliminary PCB and substrate design, along with fabrication of test vehicles for evaluating alternative material sets.
Phases two and three will address processing equipment for advanced technology, PCBs, substrates and assembly.
EI anticipates this will stimulate the recruitment of scientists and engineers to produce and deliver future technologies.
The program includes $5 million for electronics packaging R&D, EI said.
The contract is the first of a three-phased, five-year program that uses EI as a DoD research arm for exploring high-speed electronics technologies. Phase one includes system development and preliminary PCB and substrate design, along with fabrication of test vehicles for evaluating alternative material sets.
Phases two and three will address processing equipment for advanced technology, PCBs, substrates and assembly.
EI anticipates this will stimulate the recruitment of scientists and engineers to produce and deliver future technologies.
Press Releases
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Chihuahua Expo & Tech Forum
- PDR Appoints Bob Pearson of PAC-Global Texas to Central Texas Region
- Avalon Technologies Expands PCB Assembly And Design Services To Meet Growing Demand In The Electronics Industry
- KYZEN to Promote Pair of Stencil Cleaning Chemistries at SMTA Chihuahua Expo & Tech Forum